Aeris Communications competitors

Tunç Doluca joined Maxim in 1984 as a Member of Technical Staff. Tunç has personally designed over 40 products and holds 11 patents. In 1993, he was named the company's Vice President of R&D. In 1994, he became the founding General Manager of the Portable Power Business Unit. By 2005, Tunç’s responsibilities had expanded to managing seven business units and he was promoted to Group President. In 2007, Tunç became the second Chief Executive Officer in the company’s history. During his tenure as CEO, Maxim reorganized product development around end markets and completed six strategic acquisitions. Tunç oversaw the transition of Maxim’s manufacturing to a more flexible hybrid production model and improved overall manufacturing execution. In 2010, Maxim was one of the first analog companies to transition to 300mm wafer technology. In 2015, Tunç reorganized the company, creating a single organization combining all Business Units along with Sales & Marketing, as well as a focused effort on New Ventures. This new structure will allow the company to better align its current business with the needs of customers, while freeing resources to explore new business opportunities outside of our core business. Tunç was born in Ankara, Turkey, and he holds a BSEE degree from Iowa State University and an MSEE degree from the University of California, Santa Barbara. He serves on the board of directors of the Semiconductor Industry Association (SIA).

I’m a CEO and productive board member who relentlessly pursues best practices and customer satisfaction to stay ahead of competition. My innovation and focus on owning the supply chain has scaled back costs while increasing profits and customer reliability, as well as earning formal recognition: the Ernst & Young Entrepreneur of the Year NJ Regional Winner and a Connected World magazine Pioneers of IoT. I understand that achieving goals relies on all stakeholders communicating regularly and working for the same outcomes. I spend time with customers, shareholders, and employees so I can keep my finger on the pulse of the business’s overall health and make changes as needed. Always looking toward the future to anticipate and prepare for change, I excel at product development in response to market changes, managing risk, and overseeing the future direction of company initiatives. My skill set works cross-functionally across industries to help businesses… -- track industry developments and innovations to ensure ability to innovate and deliver relevant services -- generate and maintain successful networks and relationships with vendors, partners, and customers -- Identify and initiate business development and delivery strategies -- pinpoint problems, quickly implementing permanent solutions In my career I’ve helped companies grow profitably by… -- transitioning a firm into a global end-to-end solutions provider, growing sales to $200 million annually -- growing enterprise value from $8 million to $700 million -- directing more than 2,000 staff in 40 locations

Prior to joining Syniverse as CFAO in June 2020, Mr. Davies served as the CFO of Sprint Corporation from July 2018 until the closing of its merger with T-Mobile USA. Before that, he spent four years serving as Group CFO for Amsterdam-based VEON. Prior to joining VEON, Mr. Davies spent more than a decade with Vodafone Group holding various financial leadership positions in Japan, Turkey, and India, before being named CFO of Verizon Wireless in the U.S., which at the time was a joint venture between Vodafone and Verizon Communications. He started his career with KPMG in Wales before serving in elevated senior finance roles with GE, Honeywell, and the Caudwell Group in both the U.K. and the U.S. Mr. Davies graduated with an honors degree in mathematics from London’s Imperial College of Science, Technology and Medicine, is an Associate of the Royal College of Science and is a Fellow of the Institute of Chartered Accountants in England and Wales.

Frank Plastina was appointed President and CEO of Tekelec in February 2006. He brings more than 19 years of senior executive and management experience in the telecommunications industry with companies including Proxim Corporation, Warburg Pincus LLC and Nortel Networks Corporation. Prior to joining Tekelec, Mr. Plastina was executive in residence at Warburg Pincus, where he was responsible for evaluating potential investments and providing executive support to its portfolio companies. Previously, Mr. Plastina was executive chairman of Proxim, a provider of Wi-Fi and broadband wireless access products. During Mr. Plastina’s 15-year career at Nortel, he held a series of executive-level positions in the company’s Wireless, Internet Service Providers, Signaling Solutions, Mergers & Acquisitions and Finance Groups. Most recently, he was president of Nortel’s multi-billion dollar Metro and Enterprise Networks business unit, in which he led the successful development and marketing of the company’s VoIP products to service providers, enterprises and government entities.

Barjis Ghadially is a Chief Customer Officer at WorldLink Inc and is based in United States.

William Volz is a President/CEO at LOGIC DEVICES INC and Board Member at LOGIC DEVICES INC. He has worked as VP:Engineering at LOGIC DEVICES INC.