Everspin Technologies Leadership

Sanjeev leads Everspin’s manufacturing team to ensure product simplification and cost effectiveness of Toggle MRAM integrated on 0.18 and 0.13 micron silicon. His team also is responsible for process development of Spin-Torque MRAM and its integration on CMOS at 90nm and future nodes. Prior to Everspin, he was senior member Technical Staff at Freescale Semiconductor and led the integration efforts for Toggle MRAM development. Before joining Freescale, Sanjeev was member Group Technical Staff at Texas Instruments where he played a lead role in the process development and commercialization of embedded ferroelectric memories and contributed to TI's 90nm and 45nm BEOL metallization processes. He received the Technical Excellence Award in recognition of his contributions to bringing ferroelectric memories from R&D to product. As a research professor at University of Maryland, Sanjeev’s work focused on correlating thin film deposition technique, microstructure and reliability of ferroelectric memory devices. Sanjeev has authored 30 patents, more than 100 publications and numerous invited presentations. He has served as the technical program chair for ISIF and the ferroelectric symposium at MRS. He graduated from Cornell University with a doctorate in Materials Science and Engineering in 1996.

Darin Billerbeck joined Lattice in November 2010 as President and Chief Executive Officer. Prior to joining Lattice, Mr. Billerbeck served as President and CEO of Zilog, which was acquired by IXYS Corporation. Prior to joining Zilog, he served 18 years in various executive and management positions at Intel, including Vice President and General Manager of the Flash Products Group, where he managed a $2 billion business and directed the efforts of over 7,000 employees worldwide. In that position, he was responsible for developing and implementing Intel's Flash and Wireless strategic business plans. He also led several key engineering functions for Intel’s Flash Products Group including Director of Design Engineering, Director of Packaging and Test Technology, and Director of Operations. Between these roles Billerbeck was responsible for product development and many aspects of production. Earlier in his career he worked worked for Advanced Micro Devices in process technology development.

Sanjeev leads Everspin’s manufacturing team to ensure product simplification and cost effectiveness of Toggle MRAM integrated on 0.18 and 0.13 micron silicon. His team also is responsible for process development of Spin-Torque MRAM and its integration on CMOS at 90nm and future nodes. Prior to Everspin, he was senior member Technical Staff at Freescale Semiconductor and led the integration efforts for Toggle MRAM development. Before joining Freescale, Sanjeev was member Group Technical Staff at Texas Instruments where he played a lead role in the process development and commercialization of embedded ferroelectric memories and contributed to TI's 90nm and 45nm BEOL metallization processes. He received the Technical Excellence Award in recognition of his contributions to bringing ferroelectric memories from R&D to product. As a research professor at University of Maryland, Sanjeev’s work focused on correlating thin film deposition technique, microstructure and reliability of ferroelectric memory devices. Sanjeev has authored 30 patents, more than 100 publications and numerous invited presentations. He has served as the technical program chair for ISIF and the ferroelectric symposium at MRS. He graduated from Cornell University with a doctorate in Materials Science and Engineering in 1996.

Darin Billerbeck joined Lattice in November 2010 as President and Chief Executive Officer. Prior to joining Lattice, Mr. Billerbeck served as President and CEO of Zilog, which was acquired by IXYS Corporation. Prior to joining Zilog, he served 18 years in various executive and management positions at Intel, including Vice President and General Manager of the Flash Products Group, where he managed a $2 billion business and directed the efforts of over 7,000 employees worldwide. In that position, he was responsible for developing and implementing Intel's Flash and Wireless strategic business plans. He also led several key engineering functions for Intel’s Flash Products Group including Director of Design Engineering, Director of Packaging and Test Technology, and Director of Operations. Between these roles Billerbeck was responsible for product development and many aspects of production. Earlier in his career he worked worked for Advanced Micro Devices in process technology development.