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FlipChip International company history timeline

1999

C. Tytran-Palomaki, R. Stutzman, D. Alcoe, T. Kindl, J. Kresge and J. Libous, “A High Performance, Low Stress, Laminated Ball Grid Array Flip Chip Carrier,” presentation at Semicon West, Session 6 (San Jose, CA), July 14,1999.

2001

Cite this chapter as: Totta P.A. (2001) History of Flip Chip and Area Array Technology.

2005

Also in 2005, FlipChip International licensed the Fraunhofer Institute’s Electroless Ni/Au process leading to a new line of low cost flip chip and WLCSP CSP bumping offerings sold under the Elite UBM banner.

2006

Target applications of E-less Ni/Au UBMs include high temperature power devices, low cost RFID and WLCSP applications.The new process has been in commercial production since mid-2006 at our FCMS joint venture in Shanghai.

2007

FlipChip entered into a joint venture with Millennium Microtech Shanghai (MMS) to form FlipChip Millennium Shanghai (FCMS). FCMS opened in March of 2007 and provides “Full Turn- Key” wafer bumping and die packaging services, focusing on the Asian market.

FCI’s Elite SFC and Elite WLCSP product offerings were qualified and fully deployed at FCMS during the remainder of 2007.

2014

Tianshui Huatian Technology Company Ltd. agreed to acquire 100% of FlipChip international LLC (FCI) on December 11, 2014.

2015

HuaTian Technology Corporation completed the acquisition of FlipChip international LLC (FCI) on April 1, 2015.

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Founded
1996
Company founded
Headquarters
Phoenix, AZ
Company headquarter
Founders
David Wilkie,Steve Sanghi
Company founders
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FlipChip International history FAQs

Zippia gives an in-depth look into the details of FlipChip International, including salaries, political affiliations, employee data, and more, in order to inform job seekers about FlipChip International. The employee data is based on information from people who have self-reported their past or current employments at FlipChip International. The data on this page is also based on data sources collected from public and open data sources on the Internet and other locations, as well as proprietary data we licensed from other companies. Sources of data may include, but are not limited to, the BLS, company filings, estimates based on those filings, H1B filings, and other public and private datasets. While we have made attempts to ensure that the information displayed are correct, Zippia is not responsible for any errors or omissions or for the results obtained from the use of this information. None of the information on this page has been provided or approved by FlipChip International. The data presented on this page does not represent the view of FlipChip International and its employees or that of Zippia.

FlipChip International may also be known as or be related to Flip Chip International L.L.C., FlipChip International, FlipChip International LLC and Flipchip International.