INTEGRA Technologies Jobs

- 20 Jobs

  • RF 2 Engineer, Remote

    * Be effective with minimal supervision Company Description Integra Technologies is a global leader in the sourcing, packaging, testing and characterization of highly specialized, mission-critical semiconductor components and related value-added services for high-reliability ("Hi-Rel") applications where dependability and failure-free performance are of paramount importance.
    $72k-94k yearly est.38d ago

  • Auto Pick Operator Level 1, Swing shift

    * Able to planning and expediting jobs base on knowledge of machine capabilities, operator capabilities, and job difficulty. Lead: * Serve as back-up team leader and perform operator pass down at shift change. Job DescriptionPOSITION DESCRIPTION Position Title: Auto Pick Operator - All Levels Reports To: Production Manager Department Name: 150 Mfg-Pick and Place/Plate Location: Silicon Valley FLSA Status: Non-Exempt Swing shift: Monday-Friday 2:30PM-11:00PM POSITION SUMMARY Perform auto and manual Pick and Plate die from wafers to waffle pack or gel pack per customer's requests by emaps or inked dots.
    $32k-39k yearly est.4d ago

  • Quality Control Operator - Day Shift

    The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will). POSITION DESCRIPTION Job Code: Reports To: Quality Control Production Manager Department Name: Quality Control FLSA Status: Non-Exempt Day Shift: Monday-Friday 6:00am-2:30pm POSITION SUMMARY Use microscope to perform visual inspection of Integrated Circuit units of dies and assembled units.
    $37k-46k yearly est.15d ago

  • Senior Project Engineer

    The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).
    $93k-120k yearly est.18d ago

  • RF Sort Operator Level 2

    The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).
    $27k-33k yearly est.32d ago

  • Backgrind Operator Level 4 - Swing shift

    Job DescriptionSalary is dependent on experience and education. Swing positions have a 10% differential and Graveyard positions have a 16% differential. JOB DESCRIPTION Job Code: Reports To: Production Manager Department Name: 130 - Mfg - Thinning and Polishing FLSA Status: Non-exempt POSITION SUMMARY Perform basic and complex preparation of wafer processing and wafer thinning including but not limited to grinder machine setup, wafer mounting, grinding in different wafer material, thinning individual die, manual mounting and detaping for high bumped wafers. KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE Level 1: * Perform manual back grind tape application and wafer detaping. * Perform wafer visual inspection using microscope and magnifying glass. * Measure wafer thickness using drop gauge and generate SPC data sheet. * Operate SEC mounting system and 8" and 12" Ultron mounting systems. * Operate 8"-12" Ultron UV expose systems. * Basic operation of grinder machines. * Perform grinder machine setup and cleaning. * Setup and operate Lintec 3500 Laminator. * Understanding the use of EPICOR system. * Flexible to perform other duties as assigned. Level 2: * Evaluate non-bump wafer tape and manually calculate backgrind characterization. * Identify backgrind problems and provide solutions. * Mount and re-mount 12" wafer. * Handling of thin wafer and ultra-thin wafer. * Perform DBG and quarter wafer dog ear thinning for 8" and 12" wafer. * Perform polishing 6" and 8" wafers. * Flexible to perform other duties as assigned. Level 3: * Perform grinding sapphire, GaAs wafers and metal removal grinding * Perform grinding InP wafers and reprocessing wafers * Perform individual die thinning and surface mode grinding * Be able to evaluate engineering projects, draft work instructions and schedule jobs and tools needed. * Provide on-the-job training for level 1 and level 2 operators if needed. * Effectively manage workflow, coordinate work among team members and demonstrate leadership and problem solving. * Flexible to perform other duties as assigned. * Perform polishing 6" and 8" GaAs and bonded wafers. * Perform manual backgrind tape application and wafer detaping for high bump wafers. * Flexible to perform other duties as assigned. Level 4: * Proficient in performing full range of all department skills of all levels * Perform in the capacity of back up team leader as needed * May operate up to three fully automatic machines simultaneously * Be able to evaluate engineering projects, draft work instructions and schedule jobs and tools needed. * Provide on-the-job training for other levels of operators if needed. * Effectively manage workflow, coordinate work among team members and demonstrate leadership and problem-solving. * Cooperate with business needs including shift changes and priority changes * Flexible to perform other duties as assigned. Lead: * Serve as back-up team leader and perform operator pass down at shift change. * Responsible for inventory, material requests and hands-on job execution to ensure on-time delivery. * Verify machine setup and update department schedules. * Provide on-the-job training for new operators. * Flexible to perform other duties as assigned. JOB REQUIREMENTS INCLUDE Education: High school diploma or equivalent required. Experience: Minimum one to five years of experience with machine operation or semiconductor production test . Knowledge/Skills: Level 1 and 2: * Familiar with applicable machine operation and basic arithmetic operation * At least six months experience in wafer thinning and polishing required. * Familiar with grinder machines setup and wafer mounting. Level 3 and 4: * In-depth understanding of blade overall specification and blade process application * In-depth understanding of machine parameter SUPERVISORY RESPONSIBILITIES Total Number of Employees Directly Supervising: _0_ Number of Subordinate Supervisors Reporting to Position: _0_ This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified. In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will). PHYSICAL REQUIREMENTS INCLUDE In an average workday, employee must (check one frequency for each task): Task None Occasional Frequent Constant Stand ☐ ☐ ☐ ☒ Walk ☐ ☐ ☐ ☒ Sit ☐ ☐ ☒ ☐ Bend/stoop ☒ ☐ ☐ ☐ Climb ☐ ☒ ☐ ☐ Reach above shoulders ☐ ☒ ☐ ☐ Squat/crouch/kneel ☐ ☒ ☐ ☐ Push/pull ☐ ☒ ☐ ☐ Lift ☐ ☒ ☐ ☐ Usual amount ☐
    $36k-47k yearly est.19d ago

  • 2nd Optical Inspector Level 1

    Use microscope equipment to perform visual inspection of die and other components by following standard and customized requirements per customer requests. Categorize defects follow standard or customized specification. KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE Level 1: * Perform visual inspection on die based on commercial and military criteria per customer's request. If discrepancies are found, initiate discrepancy report (DR) and turn them to DR coordinator. * Track documents and jobs in real time basis and enter data into Epicor system. Ensure data recording on lot travelers is accurate. * Understand the difference between Good and Reject die reporting, specify proper reject coding. * Perform die sidewall inspection by following guidelines in specified criteria. * Perform re-inspection job after discrepancy report released for low yield. * Perform die plate monitor and inspection of die devices. * Meet 95%+ yield requirement or better at QC sample inspection. * Identify and report process deviations to supervisor. * Meet quality goals, safety requirements, and follow company policies. * Flexibility to perform other duties as assigned. Level 2: * Perform visual inspection on die devices in compliance with military criteria. * Back fill die on cavity that need to be reinspected, stack of waffle pack with good and bad dies and record in summary report before submitting job to Quality Control. * Perform backside inspection based on customer specifications. * Perform INP inspection on die based on INP criteria. * Perform flip die in bump die per customer specifications. * Meet or exceed daily output of 200 die per hour and 95%+ yield requirement or better at QC sample inspection. * Identify and report process deviations to supervisor. * Meet quality goals, safety requirements, and follow company policies. * Flexibility to perform other duties as assigned. Level 3: * Perform visual inspection of 100x or higher in magnifications for verification of defects of die devices. * Understand many different rules and exceptions on different die devices for visual inspection. * Understand all criteria both hermetic and non-hermetic for inspection. * Perform visual inspection in device specifications to the GaAs visual document. Be able to identify different die devices by the string near the edge. * Perform visual inspection back side and front side for Totsuka dies. * Perform visual inspection & inking wafer to Totsuka. * Use X-ray machine to handle die orientation for accuracy. * Responsible to operate machine using Camtek tool for wafer inspection. Review defects found per customer specs. Understanding the editing and reclassification of wafers. * Meet or exceed 95%+ yield requirement or better at QC sample inspection. * Identify and report process deviations to supervisor. * Meet quality goals, safety requirements, and follow company policies. * Flexibility to perform other duties as assigned. Level 4: * Perform visual inspection of 100x or higher in magnifications for verification of defects of die devices. * Understand many different rules and exceptions on different die devices for visual inspection. * Understand all criteria both hermetic and non-hermetic for inspection. * Perform visual inspection in device specifications to the GaAs visual document. Be able to identify different die devices by the string near the edge. * Use X-ray machine to handle die orientation for accuracy. * Responsible to operate machine using Camtek tool for wafer inspection. * Review defects found per customer specs. Understanding the editing and reclassification of wafers. * Meet or exceed 95%+ yield requirement or better at QC sample inspection. * Identify and report process deviations to supervisor. * Meet quality goals, safety requirements, and follow company policies. * Flexibility to perform other duties as assigned. Lead: * Serve as back-up team leader and perform operator pass down at shift change. * Responsible for inventory, material requests and hands-on job execution to ensure on time delivery. * Verify machine setup and update department schedules. * Provide on-the-job training for new operators. * Flexibility to perform other duties as assigned. JOB REQUIREMENTS INCLUDE Education: High school diploma or equivalent required. Experience: Minimum one year experience with semiconductor production test. Knowledge/Skills: * Familiar with procedure of wafer and die. * Familiar with devices wafer, wafer maps, die location, multi-die ID, small and thin die, big die, bump die. * Experience with hand tools such as tweezers, vacuum, pickup tools, die handling. SUPERVISORY RESPONSIBILITIES Total Number of Employees Directly Supervising: _0_ Number of Subordinate Supervisors Reporting to Position: _0_ This job description is intended
    $50k-84k yearly est.24d ago

  • Wirebond Operator Level 4, Day Shift

    The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).
    $34k-48k yearly est.18d ago

  • Back End Operator Level 1 - Swing Shift

    Job DescriptionSalary is dependent on experience and education POSITION DESCRIPTION Job Code: Reports To: Production Manager Department Name: Mfg - Environmental Testing FLSA Status: Non-Exempt Swing Shift: Monday-Friday 2:30pm-11:00pm POSITION SUMMARY Ability to multi-task in back-end area including but not limited to: 4th opt visual inspection, lid seal, seam seal, molding, X-ray, oven, lid attach, ring attach, clean lead, tape lid, remove QFN per map, constant accessory, temp cycle, fine/gross leak, ball attach, plate maker, marking, laser mark, trimming, and recall reflow profile from furnace per traveler applicable specifications. May work with epoxy, flux, other chemicals, and hazardous materials compliance. KEY RESPONSIBILITIES/ESSENTIAL FUNCTIONS INCLUDE * Must perform all responsibilities of an inspector including visual inspection of all various products using low power microscope (7x to 30x) when needed * Make sure all specifications and procedures are followed efficiently while maintaining high quality to meet specified goals. * Learn and operate new equipment as operators expand and carry out any other responsibilities that your Supervisor or Lead may assign to you from time to time. * Maintain good housekeeping of equipment, workstations, and other areas used. * Ensure operating equipment PM, or calibration stickers are not overdue. * Attend and participate in meetings * Abide by the company safety and personnel policies * Work assigned schedule including overtime if needed. * Flexibility to perform other duties as assigned. JOB REQUIREMENTS INCLUDE Education: High school diploma or equivalent required. Knowledge/Skills: Level 1: * Select oven temperature for baking parts. * Select or recall plasma program and verify N2, Argon, Oxygen gas usage. * Sealing boats and clip selection. * Recall and select profile for Ball Attach Reflow on furnace or Hermetic solder seal or glass seal. * Operate the ring and lid attach with dispensing tool. * Tray pack, box pack, unit tube pack using vacuum seal machine and strap machine. * Recall marking plate program or create new program to make marking plate. * Select stencils and fixtures for ball attach, method to apply flux and select ball size. * Serialization ink mark and operate pad mark machine. * Setup destructive solder ball shear machine, test and certify specifications. Level 2: * Operate seam sealing machine. * Perform fine leak pressure bomb and fine leak test operation. * Operate molding machine and monitor mold temperature. * Perform X-ray product after mold process. * Operate laser marking machine and recall temperature cycle profile and operate machine follow loading requirements. * Select insert and board and operate centrifuge machine. Level 3: * Setup and convert seam sealing machine and mold to different product. * Setup marking plate maker machine. * Program new laser marking and operate machine. * Setup temperature cycle profile and operate machine follow the loading weigh requirements. * Program and modify insert and board and operate centrifuge machine. * Operate the high powered microscope. Level 4: * Proficient in performing full range of all department skills of all levels. * Perform in the capacity of back up team leader as needed. * Able to operate multiple machines simultaneously. * Be able to evaluate engineering projects, draft work instructions and schedule jobs and tools needed. * Provide on-the-job training for other levels of operators if needed. * Effectively manage workflow, coordinate work among team members and demonstrate leadership and problem solving. * Cooperate with business needs including shift changes and priority changes. * Flexible to perform other duties as assigned. SUPERVISORY RESPONSIBILITIES Total Number of Employees Directly Supervising: _0_ Number of Subordinate Supervisors Reporting to Position: _0_ This job description is intended to describe the general nature and level of work being performed. This is not intended to be an all-inclusive list of responsibilities, duties, skills required of employees so classified. In addition, this is not an employment contract and should not be construed or interpreted as creating an implied or expressed guarantee of continued employment. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will). PHYSICAL REQUIREMENTS INCLUDE In an average workday, employee must (check one frequency for each task): Task None Occasional Frequent Constant Stand ☐ ☐ ☒ ☐ Walk ☐ ☐ ☒ ☐ Sit ☐ ☐ ☒ ☐ Bend/stoop ☐ ☐ ☐ ☐ Climb ☐ ☒ ☐ ☐ Reach above shoulders ☐ ☒ ☐ ☐ Squat/crouch/kneel ☐ ☒ ☐ ☐ Push/pull ☐ ☒ ☐ ☐ Lift ☐ ☒ ☐ ☐ Usual amount ☐
    $37k-58k yearly est.31d ago

  • Die Attach Operator Level 2, Day shift

    * Setup Eutectic Die Attach machine included temperature. * Recall profile for die attach reflow on WJ Furnace Hermetic and Solder paste. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will). Knowledge/Skills: * Experience with: * Manual Die Attach operation, Microscope and manual Dispense equipment (EFD, etc.). * Die attach with customer consigned epoxy (high or low viscosity). * Manual silver glass die attach operation. * Set-up and operate automatic/manual Die Attach, Flip Chip and Dispenses equipment. * Recall and select profile for die attach reflow on WJ furnace hermetic and solder paste. * Operate Eutectic Die Attach manual. Level 3: * Select Eutectic Die Attach tooling, setup heat block temperature and operate machine. * Recall and select profile for die attach reflow on RTC furnace silver glass. * Manual Dam & Fill operation and automatic equipment (Asymtek, etc.) * Automatic Die Attach bonders (Datacon, MAT6400, etc.) * Semi-automatic Flip Chip bonders (SEC860, etc.) SUPERVISORY RESPONSIBILITIES Total Number of Employees Directly Supervising: _0_ Number of Subordinate Supervisors Reporting to Position: _0_ This job description is intended to describe the general nature and level of work being performed.
    $29k-35k yearly est.11d ago

  • Backgrind Operator Level 3 - Day shift

    Lead: * Serve as back-up team leader and perform operator pass down at shift change.
    $67k-122k yearly est.30d ago

  • Quality Control Operator Level 2 - Swing shift

    * QFN/DFN * Inspect QFN/DFN Lead Frames purchased by Integra Technologies. * Communicate repeatable QC findings to the Quality Control Production Manager. Review and approve operator support requests, perform quality control rounds, identify defective or non-conforming products, verify in-progress and completed operator paperwork, and review complete steps within a project's production cycle.
    $37k-46k yearly est.29d ago

  • 2nd Optical Inspector Level 1 - Graveyard Shift

    $50k-84k yearly est.40d ago

  • Die Attach Operator Level 1 - Day shift

    The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will). * Manual Dam & Fill operation and automatic equipment (Asymtek, etc.) * Automatic Die Attach bonders (Datacon, MAT6400, etc.) * Semi-automatic Flip Chip bonders (SEC860, etc.) SUPERVISORY RESPONSIBILITIES Total Number of Employees Directly Supervising: _0_ Number of Subordinate Supervisors Reporting to Position: _0_ This job description is intended to describe the general nature and level of work being performed. Knowledge/Skills: * Experience with: * Manual Die Attach operation, Microscope and manual Dispense equipment (EFD, etc.).
    $29k-35k yearly est.19d ago

  • Wirebond Operator Level 3 - Graveyard Shift

    The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).
    $67k-122k yearly est.23d ago

  • Quality Control Operator, Graveyard Shift

    * QFN/DFN * Inspect QFN/DFN Lead Frames purchased by Integra Technologies. * Communicate repeatable QC findings to the Quality Control Production Manager. Job DescriptionSalary is dependent on experience and education JOB DESCRIPTION Job Code: Reports To: Quality Control Production Manager Department Name: 196 - Quality Control FLSA Status: Non-Exempt Graveyard shift: Monday-Friday 10:00pm-6:30am POSITION SUMMARY Use microscopic equipment for 8+ hours per day to perform a visual inspection of die and other components by following standard and customized requirements per customer requests. Review and approve operator support requests, perform quality control rounds, identify defective or non-conforming products, verify in-progress and completed operator paperwork, and review complete steps within a project's production cycle.
    $37k-46k yearly est.25d ago

  • 2nd Optical Inspector Level 1 - Swing Shift

    $50k-84k yearly est.46d ago

  • Quality Control Operator, Swing Shift

    Job DescriptionPOSITION DESCRIPTION Position Title: Quality Control Operator Reports To: Quality Control Production Manager Department Name: Quality Control Location: Silicon Valley FLSA Status: Non-Exempt Swing shift hours: 3:00 PM - 11:30 PM POSITION SUMMARY Use microscope to perform visual inspection of Integrated Circuit units of dies and assembled units. The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).
    $37k-46k yearly est.23d ago

  • Wirebond Operator Level 2, Day Shift

    The employment relationship at Integra Technologies Inc is by mutual consent (Employment at Will).
    $61k-99k yearly est.27d ago

  • Quality Control Operator Level 3, Swing Shift

    * QFN/DFN * Inspect QFN/DFN Lead Frames purchased by Integra Technologies.
    $37k-46k yearly est.27d ago

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Updated May 30, 2023

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INTEGRA Technologies may also be known as or be related to INTEGRA Services Technologies Inc, INTEGRA Technologies, Integra Technologies and Integra® Technologies.