Machining Engineer jobs at Qualcomm

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Machine Learning Engineering If you're interested in advancing and applying mathematics, programming languages theory, and advanced algorithms to program optimization for cutting-edge machine learning accelerators, then you really want to be talking to us! The Compiler Labs unit in Qualcomm AI Software department is looking for ML Compiler engineers to join our team. We work tactically on improving existing ML compilers and strategically on developing new and innovative ML compilers. Our technical approach to compilers emphasizes powerful representations for precisely and compactly modeling programs and the optimization challenges and using advanced mathematics and algorithms for performing optimizations. We are also solid in using "old school" compiler technologies as they apply to contemporary ML challenges, and in meticulous software engineering to produce beautiful compilers. We are also keen about seeing our compilers used and having large impacts on Qualcomm's business. Mapping ML algorithms to ML accelerators is currently one of the most interesting and challenging problems for compilers. Our compiler targets include the Qualcomm Neural Signal Processor, Adreno GPUs, low-power ML accelerators, and CPU accelerators. This job description spans multiple levels, from entry to experienced. Our team is a good home for compiler developers with advanced degrees, and we have solid mentoring and give substantial responsibility quickly for entry level engineers. Preferred Qualifications: * Master's degree in Computer Science, Engineering, Electrical Engineering, or related field. * Experience with compiler development and computer architecture ML experience * A degree in the field of computer science or applied mathematics * Experience with software engineering * Solid intellectual ability, motivation, and a strong history of achievement * Excellent oral and written communication skills * Experience with MLIR, MLIR Dialects (LinAlg, Affine), Pytorch 2.0, TVM, Triton, and/or LLVM * SYCL experience * ML applications and ML optimization experience * ML architecture experience * High performance computing experience * Polyhedral compiler optimization experience * Loop transformation and vectorization experience * GPU programming, parallel programming experience * General optimization experience Principal Duties and Responsibilities: * Work on a wide range of ML compilers * Improve ML compiler optimization capabilities through benchmark analysis and profiling * Innovate new ML compiler and optimization algorithms * Upstream compiler algorithms to open-source compiler projects * Author research publications and represent the company in conferences and industry forums * For senior levels - Lead and manage projects while doing substantial technical work Minimum Qualifications: * Bachelor's degree in Computer Science, Engineering, Information Systems, or related field and 4+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR Master's degree in Computer Science, Engineering, Information Systems, or related field and 3+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR PhD in Computer Science, Engineering, Information Systems, or related field and 2+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits: $158,400.00 - $237,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Machine Learning Engineering Artificial Intelligence is changing the world for the benefit of human beings and societies. QUALCOMM, as the world's leading mobile computing platform provider, is committed to enable the wide deployment of intelligent solutions on all possible devices - like smart phones, laptops, autonomous vehicles, robotics and IOT devices. Qualcomm is creating building blocks for the intelligent edge. We are part of Qualcomm AI Research, and we focus on advancing Gen AI Technology for the Edge - including model fine tuning, hardware acceleration, model quantization, edge inference and related fields. Come join us on this exciting journey. In this particular role, you will work in a dynamic research environment, be part of a multi-disciplinary team of researchers and software engineers who work with cutting edge AI frameworks and tools. You will architect, design, develop, test, and deploy on- and off-device frameworks enabling optimization. The successful applicant should have a strong theoretical background and proven hands-on experience with enabling on-device AI using modern software engineering best practices. Must have experience and skills: * Strong Python and C++ design and implementation skills. * Linux advanced user * Working experience with AI tools for software development. * Proven hands-on experience with bash shell scripting and Linux environments. * Strong analytical, debugging and problem-solving skills. * General knowledge in ML and Gen AI. * Proven hands-on experience establishing a high-quality software delivery process using industry best-practices (code reviews, CI/CD, automation, etc.). * Strong command of GitHub Actions and/or GitLab CI. * Strong command of databases ( SQL etc. ). * Strong team player, communicator, presenter, mentor, and teacher. Preferred Experience/Skills: * Familiarity with automation frameworks ( for example Jenkins). * Previous experience with Docker/Kubernetes. * Experience developing visualization platforms ( Dashboard , UIs etc. ) * Experience developing Cloud Platforms. * Testing frameworks like Selenium. * Experience in multi-node setups and networking. * Knowledge of NPUs / ML accelerators. Preferred Qualifications: * Master's and/or PhD degree in Computer Science, Engineering, Information Systems, or related field and 5+ years of work experience in Software Engineering, Machine Learning/AI and/or Systems Engineering Minimum Qualifications: * Bachelor's degree in Computer Science, Engineering, Information Systems, or related field and 4+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR Master's degree in Computer Science, Engineering, Information Systems, or related field and 3+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR PhD in Computer Science, Engineering, Information Systems, or related field and 2+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits: $158,400.00 - $237,600.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Machine Learning Engineering The Qualcomm GPU Software team is looking for talented software engineers interested in developing software for the latest Machine Learning models on the next generation of devices. The GPU Software team is responsible for delivering device drivers, extensions for Machine Learning and tools for Snapdragon chipsets, providing best in class performance, power, and features. This role will involve working on Graphics software stack and Machine Learning SDKs and frameworks on Android, Linux and Windows. As a GPU Software Machine Learning Engineer, you are responsible for working with a team that is developing & optimizing Adreno GPU drivers for standard APIs such as OpenCL, OpenGL ES, Vulkan, and DirectX . You will be exposed to technology areas such as Image Processing and Machine Learning. This position requires close collaboration with hardware designers to understand, improve, and document hardware/software interfaces. Responsibilities will include the acceleration of Machine Learning operations for inference and training on the GPU, implementation of the latest Machine Learning models including LLMs and LVMs, writing samples and documentation, implementing interfaces to Machine Learning frameworks, development of unit tests and working with our partners, external developers, and OEMs. Skills: * Strong C/C++ programming skills * Strong knowledge of Machine Learning Theory * Familiarity with a Deep Learning Framework such as Pytorch * Familiarity with a GPGPU API such as CUDA or OpenCL. * Understanding of data structures and algorithms, including object-oriented programming * Excellent interpersonal and analytical skills with the ability to work independently Optional, preferred skills: * Device driver development, including GPU or CPU * Programming experience with Graphics APIs such as OpenGL ES/Vulkan/DX11/DX12 * Knowledge of GPGPU application development including Mathematical Operations and Image Processing. * Exposure to Embedded systems and Real-time operating systems * Experience working with ARM architecture * Familiarity with Git or other SCM tools Minimum Qualifications: * Bachelor's degree in Computer Science, Engineering, Information Systems, or related field and 2+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR Master's degree in Computer Science, Engineering, Information Systems, or related field and 1+ year of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR PhD in Computer Science, Engineering, Information Systems, or related field. Preferred Qualifications: * Master's Degree in Applied Mathematics, Computer Science, Computer Engineering, Electrical Engineering, Software Engineering, or related field. * 3+ years' experience with software development skills (e.g. data structure and algorithm design, object oriented or other software design paradigm knowledge, software debugging and testing, etc.) * 3+ years' experience with C++ programming experience * Optimizing algorithms for GPU hardware using OpenCL or CUDA * Experience with different NN architectures such as CNNs, LLMs, LVMs, etc. * Background in mathematical operations (e.g. linear algebra, fast math libraries, etc.) Principal Duties and Responsibilities: * Writes code for well-defined features, drivers, and APIs using different languages (e.g., C, C++, Python). * Assists in identifying deficiencies in designs and works with team members to develop solutions to improve designs. * Collaborates with team members to understand new features and functionality that align with needs and goals for implementation and customization. * Writes detailed design documentation and feature descriptions for projects. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits: $140,800.00 - $211,200.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.

Company: Qualcomm Technologies, Inc. Job Area: Engineering Group, Engineering Group > Machine Learning Engineering Artificial Intelligence is changing the world for the benefit of human beings and societies. QUALCOMM, as the world's leading mobile computing platform provider, is committed to enable the wide deployment of intelligent solutions on all possible devices - like smart phones, laptops, autonomous vehicles, robotics and IOT devices. Qualcomm is creating building blocks for the intelligent edge. We are part of Qualcomm AI Research, and we focus on advancing Gen AI Technology for the Edge - including model fine tuning, hardware acceleration, model quantization, edge inference and related fields. Come join us on this exciting journey. In this particular role, you will work in a dynamic research environment, be part of a multi-disciplinary team of researchers and software engineers who work with cutting edge AI frameworks and tools. You will architect, design, develop, test, and deploy on-device prototype software for cutting-edge AI use cases. The successful applicant should have a strong theoretical background and proven hands-on experience with enabling on-device AI using modern software engineering best practices. Must have experience and skills: * Strong Python and C/C++ design and implementation skills. * Knowledge of deep learning and ML frameworks ( i.e. PyTorch ). * Strong software design skills with a focus on usability. * Strong analytical, debugging and problem-solving skills. * Experience in Embedded Software development. * At least 3 years of work experience in a relevant field. Preferred extra experience and skills: * Excellent programming capabilities in Java. * Knowledge of Generative AI ( GenAI ) technologies. * Knowledge of Android programming is a plus. * Knowledge of neural network model optimization and on-target deployment is a plus. * Previous experience with Docker, Git and CI/CD. * Knowledge of NPUs / ML accelerators. Minimum Qualifications: * Bachelor's degree in Computer Science, Engineering, Information Systems, or related field and 2+ years of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR Master's degree in Computer Science, Engineering, Information Systems, or related field and 1+ year of Hardware Engineering, Software Engineering, Systems Engineering, or related work experience. OR PhD in Computer Science, Engineering, Information Systems, or related field. Qualcomm is an equal opportunity employer. If you are an individual with a disability and need an accommodation during the application/hiring process, rest assured that Qualcomm is committed to providing an accessible process. You may e-mail disability-accomodations@qualcomm.com or call Qualcomm's toll-free number found here. Upon request, Qualcomm will provide reasonable accommodations to support individuals with disabilities to be able participate in the hiring process. Qualcomm is also committed to making our workplace accessible for individuals with disabilities. (Keep in mind that this email address is used to provide reasonable accommodations for individuals with disabilities. We will not respond here to requests for updates on applications or resume inquiries). To all Staffing and Recruiting Agencies: Our Careers Site is only for individuals seeking a job at Qualcomm. Staffing and recruiting agencies and individuals being represented by an agency are not authorized to use this site or to submit profiles, applications or resumes, and any such submissions will be considered unsolicited. Qualcomm does not accept unsolicited resumes or applications from agencies. Please do not forward resumes to our jobs alias, Qualcomm employees or any other company location. Qualcomm is not responsible for any fees related to unsolicited resumes/applications. EEO Employer: Qualcomm is an equal opportunity employer; all qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or any other protected classification. Qualcomm expects its employees to abide by all applicable policies and procedures, including but not limited to security and other requirements regarding protection of Company confidential information and other confidential and/or proprietary information, to the extent those requirements are permissible under applicable law. Pay range and Other Compensation & Benefits: $140,800.00 - $211,200.00 The above pay scale reflects the broad, minimum to maximum, pay scale for this job code for the location for which it has been posted. Even more importantly, please note that salary is only one component of total compensation at Qualcomm. We also offer a competitive annual discretionary bonus program and opportunity for annual RSU grants (employees on sales-incentive plans are not eligible for our annual bonus). In addition, our highly competitive benefits package is designed to support your success at work, at home, and at play. Your recruiter will be happy to discuss all that Qualcomm has to offer - and you can review more details about our US benefits at this link. If you would like more information about this role, please contact Qualcomm Careers.

**Please Note:** **1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account)** **2. If you already have a Candidate Account, please Sign-In before you apply.** **:** Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc.. **RESPONSIBILITIES:** + Design responsibility for mechanical design aspects of ASIC packages + Use advanced FEA to quantify and optimize reliability and manufacturing + Measure and experiment to validate understanding and improve model accuracy + Collaborate closely with package designers, reliability and manufacturing partners (internal and external) + Schedule, prioritize, & track your work across 4+ projects simultaneously + Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors + Document design rules and guidelines **EDUCATION/EXPERIENCE & REQUIREMENTS:** + Bachelors in Mechanical Engineering or similar field and 12+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 10+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 7+ years of experience in FEA modeling. + Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions + Ability to calibrate modeling and results with existing empirical data + Perform mechanical testing and measurement + Devise lab scale tests to validate analyses + Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations + Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK + Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers + Self-management and organization skills + Presentation and technical documentation skills **Additional Job Description:** **Compensation and Benefits** The annual base salary range for this position is $127,100 - $203,400. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. **Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law.** **If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.** Welcome! Thank you for your interest in Broadcom! We are a global technology leader that designs, develops and supplies a broad range of semiconductor and infrastructure software solutions. For more information please visit our video library (******************************* and check out our Connected by Broadcom (************************************************************************************************************************************************* series. Follow us on Linked In Broadcom Inc (****************************************** .

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc.. RESPONSIBILITIES: * Design responsibility for mechanical design aspects of ASIC packages * Use advanced FEA to quantify and optimize reliability and manufacturing * Measure and experiment to validate understanding and improve model accuracy * Collaborate closely with package designers, reliability and manufacturing partners (internal and external) * Schedule, prioritize, & track your work across 4+ projects simultaneously * Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors * Document design rules and guidelines EDUCATION/EXPERIENCE & REQUIREMENTS: * Bachelors in Mechanical Engineering or similar field and 12+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 10+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 7+ years of experience in FEA modeling. * Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions * Ability to calibrate modeling and results with existing empirical data * Perform mechanical testing and measurement * Devise lab scale tests to validate analyses * Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations * Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK * Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers * Self-management and organization skills * Presentation and technical documentation skills Additional Job Description: Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. :Broadcom is seeking an experienced package mechanical FEA engineer for very-large and complex packages for industry-leading ASICs. You will be part of a worldwide R&D team developing high-performance package designs for ASICs for artificial intelligence (AI), networking, high-performance computing (HPC), and 5G base stations. You'll have exposure to emerging package integration technologies, such as co-packaged fiber-optic transceivers and connectors and complex chip stacking (3DIC, hybrid copper bonding, heterogeneous integration, etc). Also, you will develop and optimize unique multi-chip-module (MCM) packages and mainstream flip-chip BGA (FCBGA) packages. You'll have the opportunity to collaborate with the R&D and manufacturing teams to influence the mechanical design of new ASICs, and make engineering trade offs with warpage, stress, reliability, cost, thermal and electrical performance, etc.. RESPONSIBILITIES: Design responsibility for mechanical design aspects of ASIC packages Use advanced FEA to quantify and optimize reliability and manufacturing Measure and experiment to validate understanding and improve model accuracy Collaborate closely with package designers, reliability and manufacturing partners (internal and external) Schedule, prioritize, & track your work across 4+ projects simultaneously Create presentations for and present to various audiences : engineers, managers, senior management, customers, and vendors Document design rules and guidelines EDUCATION/EXPERIENCE & REQUIREMENTS: Bachelors in Mechanical Engineering or similar field and 12+ years of experience in FEA modeling or Masters in Mechanical Engineering or similar field and 10+ years of experience in FEA modeling or PhD in Mechanical Engineering or similar field and 7+ years of experience in FEA modeling. Ability to evaluate complicated numerical simulation results against first principles such as strength of materials solutions Ability to calibrate modeling and results with existing empirical data Perform mechanical testing and measurement Devise lab scale tests to validate analyses Seek mechanical solutions at the intersection of manufacturing limitations, required reliability and customer expectations Ansys Classic/Mechanical experience is preferred. Equivalent tool is OK Cooperate with our world-wide team (multiple time zones), including co-design with internal team members and external (Vendor) designers Self-management and organization skills Presentation and technical documentation skills Additional Job Description: Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : Broadcom is the leading provider of silicon solutions to high-performance computing, networking, mobile and consumer market segments in aggregate, covering the widest spectrum of process technologies from the very leading edge to legacy. This position is within Broadcom's Central Engineering organization, as part of the technology platform team.The technology platform team delivers CAD, design-access, custom device enhancements to foundry process technologies, silicon correlation and device & reliability modeling functions, all to support the high volume product needs of the diversified businesses. We are looking for an experienced engineer with the technical knowledge and hands on experience with advanced silicon technology, device modeling concepts, measurement automation, data collection & analysis, and GDS to SPICE design flows for silicon correlation using custom process characterization and modeling test-chips. Layout experience with device modeling test-structures would be beneficial. Key requirements:(1) Device physics and process technology knowledge with 16nm and newer nodes.(2) Device modeling for HSPICE/SPECTRE circuit simulation, and GDS to SPICE flow in Cadence/Virtuoso.(3) Device/circuit characterization with DC to RF measurement equipment.(4) Automation skills for data-analysis and lab equipment.(5) EE's with MS + 10 years or Ph.D + 7 years are ideal. Engineers with basic qualifications in Materials Science & Physics possessing the needed technical experience are also encouraged to apply.(6) Excellent communication and presentation skills needed to work with a world-wide design engineering community are needed. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : As a Principal Hardware Engineer, you will design, develop, and deliver Mechanical assemblies, including full chassis design for Ultra High-performance and power electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start-up-like environment and are proud of delivering high-quality products. We believe in small teams of highly experienced engineers. This team will own all aspects of Mech design, including BOM creation, participation with vendor negotiators, product look and feel, design, development, and validation. With DFM, a critical component of our development. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining. You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams. Key Qualifications & Experience: High-powered production enclosures capable of cooling 2kW/RU+ Power and Thermal issues associated with PCBs with 1kW+ footprints Proven collaboration with production shops and manufacturing teams to streamline production processes, enhance quality control, and ensure smooth transitions from design to implementation. Understanding of relevant US, European, and Asian regulations and standards, ensuring all designs meet safety, environmental requirements. Demonstrate lifecycle product ownership of complex products. Participating in a cross-functional team from product inception to volume production Work with support groups, including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability Bachelor's degree in Mechanical Engineering and 12+ years Beneficial Experience: Small Team Lead or proven technical mentor Additional Job Description: Compensation and Benefits The annual base salary range for this position is $141,300 - $226,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : The Network Switch Group at Broadcom has brought some of the most complex and cutting edge networking ASIC's and multi-chip solutions to market. The group develops ASIC's for L2/L3 switching and routing for various market segments. These products support the latest networking protocols and features as well as manage extremely large volumes of traffic in the order of tens of Terabits/sec. These networking ASIC's support a large number of ports and port speeds ranging from tens of Mb/s to hundreds of Gb/s as well as various line interfaces and protocols.. You will be responsible for the micro-architecture, design, RTL coding, debugging and synthesis of complex functional blocks in the Traffic Manager / Memory Management Unit used in Broadcom's market leading network switch products. Responsibilities include: High quality micro-architecture and design specifications Verilog RTL coding and synthesis Testplan reviews, assertions, debugging, code and functional coverage Floor plan, timing, congestion resolution with Physical Design team Post silicon bring-up, debug, failure analysis. BS + 12+ years of related experience or MS + 10+ years of relevant experience Additional Job Description: Compensation and Benefits The annual base salary range for this position is $141,300 - $226,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : Broadcom develops critical infrastructure chips that empower customers across nearly every major segment of the semiconductor industry-including AI-to build advanced ASIC solutions. Join the Design Implementation team within Broadcom's ASIC Products Division, where we deliver cutting-edge CMOS ASICs for leading AI/ML, wireless, networking, computing, and storage applications. In this role, you will gain hands-on experience taking innovative integrated circuit designs from concept to product release, becoming a key contributor to all aspects of physical ASIC design. Job Duties and Responsibilities may include: Communicating directly with customers Integrating memories, SerDes, and I/O subsystems Integrating test structures and clocking architectures Evaluating design trade-offs involving power, area, and performance Addressing challenges related to timing closure, and signal integrity Working on timing analysis for both mission and test modes Requirements: BS Degree in Electrical Engineering and 12+ years related experience or MS in Electrical Engineering and 10+ years related work experience. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $141,300 - $226,000. This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : As a Principal Hardware Engineer, you will design, develop, and deliver Ultra High-performance electronic products. In addition, you may provide technical leadership to a small design team. We are looking for candidates who thrive in a fast-paced, start-up-like environment. We believe in small teams of highly experienced engineers. As such, we have a One Person One Board development culture, so you will own all aspects of EE hardware design, including BOM creation, participation with vendor negotiators, circuit/board design, development, and validation. Our Cradle to Grave lifecycle product development means ownership does not end at product ship. You will help with customer trials, field issues, and product sustaining. You will work collaboratively with an interdisciplinary team of Hardware, ASIC, Signal, Mechanical, Thermal, Diagnostic, Packaging, and Manufacturing engineers. In addition, Joint development programs may require extensive interaction with partner engineering teams. Key Qualifications & Experience: Large high-powered SOCs based on advanced silicon and packaging process technologies, including 2D, 2.5D, and 2.5D with 3D memories. Precision Scopes, Analyzers, development & validation tools. Understanding of Power and Thermal issues associated with PCBs with 1kW+ footprints High-speed & High-density signaling with SerDes rates of 112G - 224G Demonstrate lifecycle product ownership of complex products from conception to sustained high volume production. Participating in a cross-functional team including Sales, Marketing, Purchasing, Manufacturing, Customer Support, Compliance, Safety, and Sustainability Bachelor's degree in electrical engineering and 12+ years Beneficial Experience: Small Team Lead or proven technical mentor of High-Speed Hardware designers. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $141,300 - $226,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : Designs and develops integrated analog circuits. Oversees definition, design, verification, and documentation for ASIC development. Determines circuit design and system simulation. Defines module interfaces/formats for simulation. Contributes to the development of multidimensional designs involving the layout of complex integrated circuits. Evaluates all aspects of the process flow from high-level design to layout and timing and power use. Analyzes equipment to establish operation data, conducts experimental tests, and evaluates results. May also review vendor capability to support development. - Knowledge: Having wide-ranging experience, uses professional concepts and company objectives to resolve complex issues in creative and effective ways. • Strong project management skills • Leads design and delivery of new products/process • Functional breadth and depth, plus expert in complementary fields • Applies broad concepts and theories to achieve innovative and effective solutions to complex problems Job Complexity / Contribution : Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results. Networks with key contacts outside own area of expertise. • Will champion significant projects, programs and business initiatives using demonstrated creativity and ingenuity • Team leader • Leads major projects • Influences or impacts others' priorities, decisions or activities • Escalation point for complex issues • Coaches and mentors other junior team members - Supervision : Incumbents provide a leadership role for the work group through knowledge in his/her area of specialization. Generally free to determine work priorities based on general direction from managers. • Determines methods and procedures on new assignments • Consults with management on long-range goals • Determines own priorities, both tactical and strategic • Experience : Bachelor's and 12+ years of related experience; at this level post-graduate coursework may be desirable or Masters degree and 10+ years of related experience or PhD and 7+ years of related experience Additional Job Description: Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : In this line of work, the prospective employee will specialize in high-speed analog circuit design for wireline transceivers Determines design approaches and parameters. Analyzes equipment to establish operating data; conducts experimental tests and evaluates results. Selects components and equipment based on analysis of specifications and reliability. May also review vendor capability to support product development. Layout/design work is done in ASIC product environment. Works on problems of moderate scope where analysis of situations or data requires a review of a variety of factors. Exercises judgment within defined procedures and practices to determine appropriate action. Builds productive internal/external working relationships. The prior work or academic experience in one or more of the following design areas are highly desirable: High-Speed (>10Gbps) ADC and DAC Design High-Speed (>28GHz) and Low Jitter ( High Linearity (1-3% THD) Low-Noise TIA and Laser Driver Design Equalization Techniques for Backplanes and Optical Links High-Speed Low Latency Clock & Data Recovery Circuits High-speed RF techniques, LNA, Power Amplifier Circuits The following skills are highly desirable: Circuit & Layout expertise in advanced process nodes (2nm, 3nm, 5nm , 7nm CMOS FinFet) Strong understanding and user experience in EM tools such as HFSS, EMX Strong DSP knowledge, and capability to analyze systems using Matlab and Verilog AMS Minimum Qualifications Bachelor's degree in EE or a related field 12+ years of experience in analog circuit design, high-speed mixed-signal design, or a closely related technical discipline. Preferred Qualifications Graduate studies (MS/PhD) in analog circuit design or a related field. Academic research, thesis work, or industry project experience in analog circuits. Demonstrated foundation in analog design fundamentals through coursework, research, or prior roles. Candidates with demonstrated interest and experience in analog circuit design are encouraged to apply. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $127,100 - $203,400 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : We are part of the core switching group (CSG) at Broadcom developing industry leading network switches for enterprise and mega scale data centers . We are looking for experienced engineers to design cutting edge CoWos 2.5D , 3D interposer designs. You will be working on designing interposers starting with custom routing for high speed interfaces, bump map design , routing and physical verification and tapeout to the foundries. As part of your job you will be interacting with packaging , signal integrity and foundries to meet the packaging, SI and physical requirements of the interposers. Experience with interposer designs including CoWoS, 2.5D/3D integration using Cadence Innovus/Integrity or Synopsys 3DIC compiler is a must. Candidates should have a strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies. Strong automation expertise related to bump pattern generation , routing structure development for high speed interfaces, and chip finishing are required to handle multiple Interposer designs in parallel. Basic understanding of routing structure impact on high-speed signal integrity (SI), power integrity (PI), and thermal analysis is required. Technical Skills & Experience: Experience with interposer and advanced packaging design, including CoWoS, 2.5D/3D Proficiency with EDA tools such as Cadence (Innovus, Integrity), Synopsys (3DIC compiler), Mentor Graphics (Calibre) for layout generation, editing and verification Strong understanding of TSV design, micro-bumps, solder bumps, and interconnect technologies. Basic understanding of high-speed signal integrity (SI), power integrity (PI), and thermal analysis. Familiarity with semiconductor fabrication processes, particularly for silicon interposers. Strong scripting skills (Python, Tcl, SKILL) for automation and flow customization. Ability to work with cross-functional teams including IC design engineers, packaging egineers, and foundries Additional Skills: Strong problem-solving skills and attention to detail. Excellent communication and teamwork skills. Ability to document design processes, specifications, and reviews. Familiarity with 3DBlox interposer modelling language is a plus Preferred Qualifications: Hands-on experience with high-density interposers in complex packaging environments. Strong scripting skills to automate the interposer design flow Previous experience at semiconductor or advanced packaging companies. Educational Background: Bachelor's in Electrical Engineering, Microelectronics, or related fields and 8+ years of related experience, or a Master's degree and 6+ years of related experience Additional Job Description: Compensation and Benefits The annual base salary range for this position is $120,000 - $192,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : : * This opening work on chip design which enables 100G-1.6T AEC/optical fiber communication * Chip and board bring up and embedded firmware development for ARM-based microcontrollers inside optical modules/CPO Job Requirement: * B.S degree in EE or computer Engineering and 8+ years of related experience * M.S degree and and 6+ years of related experience, or Ph.D in EE or Computer and 3+ years of related experience * Expert proficiency in Embedded C/C++ with a strong understanding of memory management, pointers and register-level programming * Good knowledge of ARM subsystem * Good knowledge of high speed digital circuit design. * Good knowledge of optical components (lasers, Mach-zehnder modulators, photo-detectors, TIAs) and optical standards (IEEE 802.3 OIF) * Proficiency with peripherals: ADC, DAC, GPIO, MDIO, I2C, SPI, UART * Hardware control loops: implement automatic gain control/equalizer/CDR loop * DSP integration: interface with high-speed DSPs to configure serdes and monitor link health Additional Job Description: Compensation and Benefits The annual base salary range for this position is $108,000 - $172,800 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : : This opening work on chip design which enables 100G-1.6T AEC/optical fiber communication Chip and board bring up and embedded firmware development for ARM-based microcontrollers inside optical modules/CPO Job Requirement: B.S degree in EE or computer Engineering and 8+ years of related experience M.S degree and and 6+ years of related experience, or Ph.D in EE or Computer and 3+ years of related experience Expert proficiency in Embedded C/C++ with a strong understanding of memory management, pointers and register-level programming Good knowledge of ARM subsystem Good knowledge of high speed digital circuit design. Good knowledge of optical components (lasers, Mach-zehnder modulators, photo-detectors, TIAs) and optical standards (IEEE 802.3 OIF) Proficiency with peripherals: ADC, DAC, GPIO, MDIO, I2C, SPI, UART Hardware control loops: implement automatic gain control/equalizer/CDR loop DSP integration: interface with high-speed DSPs to configure serdes and monitor link health Additional Job Description: Compensation and Benefits The annual base salary range for this position is $108,000 - $172,800 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : Designs and develops hardware products, parcularly DVT boards for integrated circuits . Evaluates reliability of materials, properties and techniques used in production; plans, designs and develops electronic parts, components, integrated circuitry, mechanical systems, equipment and packaging, optical systems and/or DSP systems. - Knowledge: Having wide-ranging experience, uses professional concepts and company objectives to resolve complex issues in creative and effective ways. • Strong project management skills • Leads design and delivery of new products/process • Functional breadth and depth, plus expert in complementary fields • Applies broad concepts and theories to achieve innovative and effective solutions to complex problems - Job Complexity / Contribution : Works on complex issues where analysis of situations or data requires an in-depth evaluation of variable factors. Exercises judgment in selecting methods, techniques and evaluation criteria for obtaining results. Networks with key contacts outside own area of expertise. • Will champion significant projects, programs and business initiatives using demonstrated creativity and ingenuity • Team leader • Leads major projects • Influences or impacts others' priorities, decisions or activities • Escalation point for complex issues • Coaches and mentors other junior team members - Supervision : Incumbents provide a leadership role for the work group through knowledge in his/her area of specialization. Generally free to determine work priorities based on general direction from managers. • Determines methods and procedures on new assignments • Consults with management on long-range goals • Determines own priorities, both tactical and strategic Experience : Bachelor's and 8+ years of related experience; at this level post-graduate coursework may be desirable or Master's degree and 6+ years of related experience or PhD and 3+ years of related experience Additional Job Description: Compensation and Benefits The annual base salary range for this position is $108,000 - $172,800 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.

Please Note: 1. If you are a first time user, please create your candidate login account before you apply for a job. (Click Sign In > Create Account) 2. If you already have a Candidate Account, please Sign-In before you apply. : This opening work on chip design which enables 10Gbps/40Gbps/100Gbps/400Gbps backplane/cable/optical fiber communication and 5G transciever prepare detailed design document HDL coding, equivalency checking, STA result review, CDC checks, Lint checks, RTL/gate level simulations & silicon debugging scripting for various IC design tasks such as STA, equivalency checks, silicon debug etc. prepare block level resource requirements & development schedule generate test plans for post silicon validation This opening work on chip design which enables 10Gbps/40Gbps/100Gbps/400Gbps backplane/cable/optical fiber communication and 5G transciever prepare detailed design document HDL coding, equivalency checking, STA result review, CDC checks, Lint checks, RTL/gate level simulations & silicon debugging scripting for various IC design tasks such as STA, equivalency checks, silicon debug etc. prepare block level resource requirements & development schedule generate test plans for post silicon validation Requirement: B.S degree in EE or computer Engineering and 5+ years of related experience M.S degree/Ph.D in EE or Computer Engineering and and 3+ years of related experience Good knowledge of high speed digital circuit design. Good knowledge of ARM subsystem Good knowledge of digital signal processing and error correction code is a plus Strong analytical and problem solving skills as well as hands-on lab debugging experiences Good Knowledge in languages relevant to the ASIC/system development process including Verilog, Unix/Perl Scripting or Python, matlab and C. Self-motivated, excellent communication skills and ability to excel in a team environment. Good organization skills, able to follow through & bring issue to closure FEC knowledge is a plus Knowledge Backplane/cable/optical fiber communication/5G is a plus Be able to work with teams at remote locations with different time zone. Additional Job Description: Compensation and Benefits The annual base salary range for this position is $91,000 - $146,000 This position is also eligible for a discretionary annual bonus in accordance with relevant plan documents, and equity in accordance with equity plan documents and equity award agreements. Broadcom offers a competitive and comprehensive benefits package: Medical, dental and vision plans, 401(K) participation including company matching, Employee Stock Purchase Program (ESPP), Employee Assistance Program (EAP), company paid holidays, paid sick leave and vacation time. The company follows all applicable laws for Paid Family Leave and other leaves of absence. Broadcom is proud to be an equal opportunity employer. We will consider qualified applicants without regard to race, color, creed, religion, sex, sexual orientation, national origin, citizenship, disability status, medical condition, pregnancy, protected veteran status or any other characteristic protected by federal, state, or local law. We will also consider qualified applicants with arrest and conviction records consistent with local law. If you are located outside USA, please be sure to fill out a home address as this will be used for future correspondence.