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Semiconductor engineer vs packaging engineer

The differences between semiconductor engineers and packaging engineers can be seen in a few details. Each job has different responsibilities and duties. It typically takes 2-4 years to become both a semiconductor engineer and a packaging engineer. Additionally, a semiconductor engineer has an average salary of $96,951, which is higher than the $88,452 average annual salary of a packaging engineer.

The top three skills for a semiconductor engineer include data analysis, RF and failure analysis. The most important skills for a packaging engineer are CAD, project management, and solidworks.

Semiconductor engineer vs packaging engineer overview

Semiconductor EngineerPackaging Engineer
Yearly salary$96,951$88,452
Hourly rate$46.61$42.52
Growth rate10%10%
Number of jobs37,16254,028
Job satisfaction--
Most common degreeBachelor's Degree, 77%Bachelor's Degree, 79%
Average age4242
Years of experience44

What does a semiconductor engineer do?

As a semiconductor engineer, your main job is to make semiconductors that are mostly made out of silicon. You have to create electrical products that enable the integration of workers, materials, and machines. Semiconductor engineers increase the efficiency of these semiconductors and develop new technologies for creating semiconductors for electric circuitry.

What does a packaging engineer do?

A Packaging Engineer plans and implements packaging designs to ensure product integrity and appeal. Their primary duties include supervising and managing the complete packaging development process, analyzing engineering drawings, and conducting periodic vendor reviews.

Semiconductor engineer vs packaging engineer salary

Semiconductor engineers and packaging engineers have different pay scales, as shown below.

Semiconductor EngineerPackaging Engineer
Average salary$96,951$88,452
Salary rangeBetween $69,000 And $134,000Between $65,000 And $118,000
Highest paying CityBothell, WASanta Rosa, CA
Highest paying stateWashingtonCalifornia
Best paying companyApplied MaterialsApple
Best paying industry-Technology

Differences between semiconductor engineer and packaging engineer education

There are a few differences between a semiconductor engineer and a packaging engineer in terms of educational background:

Semiconductor EngineerPackaging Engineer
Most common degreeBachelor's Degree, 77%Bachelor's Degree, 79%
Most common majorElectrical EngineeringEngineering And Industrial Management
Most common collegeUniversity of PennsylvaniaNorthwestern University

Semiconductor engineer vs packaging engineer demographics

Here are the differences between semiconductor engineers' and packaging engineers' demographics:

Semiconductor EngineerPackaging Engineer
Average age4242
Gender ratioMale, 89.3% Female, 10.7%Male, 77.1% Female, 22.9%
Race ratioBlack or African American, 4.5% Unknown, 3.9% Hispanic or Latino, 11.0% Asian, 14.0% White, 66.4% American Indian and Alaska Native, 0.2%Black or African American, 4.6% Unknown, 3.9% Hispanic or Latino, 11.2% Asian, 13.1% White, 67.0% American Indian and Alaska Native, 0.2%
LGBT Percentage4%4%

Differences between semiconductor engineer and packaging engineer duties and responsibilities

Semiconductor engineer example responsibilities.

  • Manage Jenkins security by providing specific access to authorize developers/testers using project base matrix authorization strategy.
  • Accelerate the development cycle for IBM server microprocessors and ASICs.
  • Shorten the production ramp for IBM server microprocessors through data automation and analysis.
  • Improve the net performance and reliability of IBM's high-end system microprocessor by defining fab process parametric targets and limits.
  • Complete CAPA investigations and implementation.
  • Conduct geotechnical and environmental subsurface investigations.
  • Show more

Packaging engineer example responsibilities.

  • Manage UAT testing of App-V/Thin-App applications.
  • Manage implementation and changes using FDA compliant documentation and change management processes.
  • Manage Linux staging and testing environments and also automate application packaging and deployments.
  • Manage packaging redesign project to maintain compliance with current FDA regulations for medical device packaging.
  • Manage in-house process, which include art direction, copy/editorial development, photography, and print production management for domestic/international market.
  • Develop windows application in c #to process customer and policy information.
  • Show more

Semiconductor engineer vs packaging engineer skills

Common semiconductor engineer skills
  • Data Analysis, 21%
  • RF, 19%
  • Failure Analysis, 18%
  • R, 7%
  • Sputtering, 7%
  • SPC, 5%
Common packaging engineer skills
  • CAD, 9%
  • Project Management, 8%
  • Solidworks, 7%
  • ASTM, 5%
  • Package Design, 5%
  • ISTA, 4%

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