Post job

Semiconductor processing group leader vs die attacher

The differences between semiconductor processing group leaders and die attachers can be seen in a few details. Each job has different responsibilities and duties. Additionally, a semiconductor processing group leader has an average salary of $52,259, which is higher than the $42,325 average annual salary of a die attacher.

Semiconductor processing group leader vs die attacher overview

Semiconductor Processing Group LeaderDie Attacher
Yearly salary$52,259$42,325
Hourly rate$25.12$20.35
Growth rate6%7%
Number of jobs33,1191,156
Job satisfaction--
Most common degreeBachelor's Degree, 67%High School Diploma, 67%
Average age4343
Years of experience--

Semiconductor processing group leader vs die attacher salary

Semiconductor processing group leaders and die attachers have different pay scales, as shown below.

Semiconductor Processing Group LeaderDie Attacher
Average salary$52,259$42,325
Salary rangeBetween $21,000 And $126,000Between $24,000 And $72,000
Highest paying City--
Highest paying state--
Best paying company--
Best paying industry--

Differences between semiconductor processing group leader and die attacher education

There are a few differences between a semiconductor processing group leader and a die attacher in terms of educational background:

Semiconductor Processing Group LeaderDie Attacher
Most common degreeBachelor's Degree, 67%High School Diploma, 67%
Most common majorPsychologyAccounting
Most common college--

Semiconductor processing group leader vs die attacher demographics

Here are the differences between semiconductor processing group leaders' and die attachers' demographics:

Semiconductor Processing Group LeaderDie Attacher
Average age4343
Gender ratioMale, 44.4% Female, 55.6%Male, 50.0% Female, 50.0%
Race ratioBlack or African American, 12.8% Unknown, 3.9% Hispanic or Latino, 19.8% Asian, 5.6% White, 57.1% American Indian and Alaska Native, 0.7%Black or African American, 12.8% Unknown, 3.9% Hispanic or Latino, 19.8% Asian, 5.6% White, 57.1% American Indian and Alaska Native, 0.7%
LGBT Percentage5%5%

Differences between semiconductor processing group leader and die attacher duties and responsibilities

Semiconductor processing group leader example responsibilities.

  • Set up equipment, load appropriate programs and test IC semiconductor chips, ensuring that customer specifications have been meet.
  • Perform test on new production equipment to qualify ISO-9001 specifications.
  • Prepare etching chemicals according to formulas, diluting acid with water to obtain solutions of specify concentration.
  • Exhibit leadership capabilities and display communication tactics base on participant's knowledge and abilities to maximize functionality.

Die attacher example responsibilities.

  • Work with RTV for circuit board.
  • Calibrate or adjust equipment to ensure quality production using tools such as calipers, micrometers, and height gauges.
  • Train all new hires on appropriate lines including all OSHA and ISO requirements.

Semiconductor processing group leader vs die attacher skills

Common semiconductor processing group leader skills
  • Mental Health, 54%
  • Substance Abuse, 46%
Common die attacher skills

    Browse production and manufacturing jobs