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Electronic component processor vs semiconductor processor

The differences between electronic component processors and semiconductor processors can be seen in a few details. Each job has different responsibilities and duties. Additionally, a semiconductor processor has an average salary of $76,996, which is higher than the $50,081 average annual salary of an electronic component processor.

The top three skills for an electronic component processor include electronic devices, data entry and ACH. The most important skills for a semiconductor processor are etching, JMP, and continuous improvement.

Electronic component processor vs semiconductor processor overview

Electronic Component ProcessorSemiconductor Processor
Yearly salary$50,081$76,996
Hourly rate$24.08$37.02
Growth rate-5%3%
Number of jobs9,3046,608
Job satisfaction--
Most common degreeBachelor's Degree, 36%Bachelor's Degree, 49%
Average age4343
Years of experience--

Electronic component processor vs semiconductor processor salary

Electronic component processors and semiconductor processors have different pay scales, as shown below.

Electronic Component ProcessorSemiconductor Processor
Average salary$50,081$76,996
Salary rangeBetween $35,000 And $70,000Between $51,000 And $115,000
Highest paying City-Tempe, AZ
Highest paying state-New York
Best paying company-Intel
Best paying industry-Technology

Differences between electronic component processor and semiconductor processor education

There are a few differences between an electronic component processor and a semiconductor processor in terms of educational background:

Electronic Component ProcessorSemiconductor Processor
Most common degreeBachelor's Degree, 36%Bachelor's Degree, 49%
Most common majorBusinessElectrical Engineering
Most common college--

Electronic component processor vs semiconductor processor demographics

Here are the differences between electronic component processors' and semiconductor processors' demographics:

Electronic Component ProcessorSemiconductor Processor
Average age4343
Gender ratioMale, 55.6% Female, 44.4%Male, 71.7% Female, 28.3%
Race ratioBlack or African American, 12.3% Unknown, 4.2% Hispanic or Latino, 20.0% Asian, 8.0% White, 54.6% American Indian and Alaska Native, 0.9%Black or African American, 12.5% Unknown, 4.2% Hispanic or Latino, 19.3% Asian, 8.3% White, 54.8% American Indian and Alaska Native, 0.9%
LGBT Percentage5%5%

Differences between electronic component processor and semiconductor processor duties and responsibilities

Electronic component processor example responsibilities.

  • Coach fellow team members to help attain higher QA and assist with CANDE questions to ensure efficiency.
  • Process and maintain all share drafts, ACH, and periodic payment exceptions.
  • Process all electronic processes including ACH, drafts, bill pay and wires.
  • Work directly with mortgage lenders and foreclosure attorneys to negotiate timely and cost effective repayment plans or modifications for delinquent loans.
  • Process various types of medical and facility claims, billing insurance companies with the correct ICD-9 and diagnosis codes.
  • Facilitate ICD-9 and procedural coding for outpatient hospital and clinic patients.
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Semiconductor processor example responsibilities.

  • Achieve L2 and L3 equipment certification in the copper polish area, performing machine maintenance and troubleshooting.
  • Experience with PVD, CVD, and ALD process.
  • Apply lean manufacturing and SPC principles to improve process capability and prevent excursions.
  • Sustain fab activities, maintain process specs and SPC charts for PECVD dielectric process.
  • Operate metal deposition, oxford, and metrology tools.
  • Experience in PVD, Pre-Clean, and reactive Pre-clean chamber hardware and mainframes.
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Electronic component processor vs semiconductor processor skills

Common electronic component processor skills
  • Electronic Devices, 36%
  • Data Entry, 27%
  • ACH, 19%
  • Processing Lab, 7%
  • ATM, 6%
  • Quality Standards, 6%
Common semiconductor processor skills
  • Etching, 15%
  • JMP, 11%
  • Continuous Improvement, 10%
  • Film Deposition, 9%
  • Thin Films, 8%
  • DOE, 8%

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