Microelectronics engineer vs packaging engineer

Differences between microelectronics engineer and packaging engineer duties and responsibilities

Microelectronics engineer example responsibilities.

• Define, manage, and maintain processes to improve KPI's: AHT, MTTR, NPS and FCR.
• Increase overall CMOS and MNOS performance and yield by improving gate oxide uniformity.
• Establish and maintain IP dashboard, promoting tracking key patent metrics for GE Energy/PrimeStar and competition.
• Characterize aqueous and UV ink formulations used in DOD (drop on demand) and piezo print heads.
• Used customizable integrate array microelectronics technology to emulate design function of aging non-procurable field military components ..
• Prepare soil data in geotechnical software and graphical figures to be used and review by professional engineering project managers.
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Packaging engineer example responsibilities.

• Manage UAT testing of App-V/Thin-App applications.
• Manage implementation and changes using FDA compliant documentation and change management processes.
• Manage Linux staging and testing environments and also automate application packaging and deployments.
• Manage packaging redesign project to maintain compliance with current FDA regulations for medical device packaging.
• Manage in-house process, which include art direction, copy/editorial development, photography, and print production management for domestic/international market.
• Develop windows application in c #to process customer and policy information.
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