Optoelectronics engineer vs packaging engineer

Differences between optoelectronics engineer and packaging engineer duties and responsibilities

Optoelectronics engineer example responsibilities.

• Lead a group of 9 engineers responsible for technology development for handling electronic packages (computer CPU) during HVM.
• Mask design, fabrication and testing of inp-base optoelectronic high speed and high power VCSELs
• Conduct geotechnical and environmental subsurface investigations.
• Develop optomechanical test station for mapping photoelectric sensor TX/RX overlap fields to determine lens defects and manufacturing problems.
• Develop unique JavaScript framework that allows collaborative modules to be develop and instantiate dynamically for asynchronous single page applications.

Packaging engineer example responsibilities.

• Manage UAT testing of App-V/Thin-App applications.
• Manage implementation and changes using FDA compliant documentation and change management processes.
• Manage Linux staging and testing environments and also automate application packaging and deployments.
• Manage packaging redesign project to maintain compliance with current FDA regulations for medical device packaging.
• Manage in-house process, which include art direction, copy/editorial development, photography, and print production management for domestic/international market.
• Develop windows application in c #to process customer and policy information.
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