Senior Applications Engineer jobs at Microchip Technology - 47 jobs

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await! Job Description: Microchip is seeking an entry-level Applications Engineer to join the ds PIC Micro Controllers (MCU16) group's Applications team. As an entry level Application engineer, responsibilities include representing applications in the product development team to drive the application related activities. They include but not limited to: Silicon peripheral Validation, such as UART, SPI, I2C, PWM, ADC etc. * Developing Demo boards, Application notes * Development of product data sheets and collateral * Supporting customers and field-personal on ds PIC and PIC24F MCU/DSCs * Develop and present training material for Microchip Field Engineers and Microchip customers. Requirements/Qualifications: BSEE/MSEE in Electrical Engineering or Computer Engineering with strong academic achievements and communication skills. * 0-3 years experience * Basic knowledge of hardware components, including circuit design using passive and active components is desired. * Knowledge of C and assembly programming are plus. * Ability to communicate well in both written and verbal forms and presentation skills are desired. * Prior knowledge or work experience in any of the following areas is a plus: * C/assembly Programming of PIC Microcontrollers * Analog application circuit design * Working knowledge with communication channels such as CAN, I2C, SPI, UART, USB Travel Time: No Travel Physical Attributes: Feeling, Hearing, Talking, Works Alone, Works Around Others Physical Requirements: 80% sitting, 10% standing, 10% walking Pay Range: We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature. Find more information about all our benefits at the link below: Benefits of working at Microchip The annual base salary range for this position, which could be performed in the US, is $70,304-$143,000.* * Range is dependent on numerous factors including job location, skills and experience. Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster. To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.

Job Details:Job Description: Foundry Services Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Position Overview The Aerospace, Defense and Government (ADG) Software Application Development Engineer provides technical support to Intel Foundry Services customers on improving operational efficiencies across the board. This is an opportunity to solve complex technical challenges, transform manual processes into automated CI/CD pipelines, and make a tangible impact on customer support quality and delivery speed. We are seeking a software engineer who is passionate about automation, system integration, and building robust, scalable solutions. Your work will directly shape our development and customer support workflows and infrastructure, driving innovation in the semiconductor foundry space. Key Responsibilities Automation & Innovation Identify opportunities and implement solutions for increased automation, reliability, and velocity by implementing robust generative AI/Agentic based solutions Apply industry best practices to transform manual processes into efficient automated workflows Drive operational excellence through innovative software solutions Infrastructure Management Ensure efficient planning, provisioning, installation/configuration, maintenance, and operations of software infrastructure required for automation and operations Validate and release automation solutions while maintaining high quality standards Manage software infrastructure within Intel enterprise constraints and governance requirements Cross-Functional Collaboration Work closely with ASE/Enablement and PM teams to build, test, and automate capabilities appropriate to project requirements Implement and maintain systems within constraints imposed by Intel enterprise infrastructure (IT) and other governing bodies Collaborate with diverse teams to deliver integrated solutions End-to-End Pipeline Ownership Own the complete delivery pipeline including source code management, versioning/tagging strategy, component build and packaging Develop and maintain test automation tooling, release staging, and acceptance criteria/indicators Ensure robust CI/CD pipeline implementation and maintenance Qualifications: The Minimum qualifications are required to be considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Minimum Qualifications US Citizenship is required Ability to obtain a US Government Security Clearance Bachelor's degree in Electrical / Computer Engineering, Computer Science, or in a STEM related field of study 3+ years of Python experience Experience with database technologies (i.e. SQL or similar) Preferred Qualifications: Active US government Security Clearnce with minimum of Secret level Post Graduate degree in Electrical/Computer Engineering, Computer Science, or in a STEM related field of study Experience with Generative AI and use of LLM models to build RAG systems and Agentic Solution Familiarity with containerization technologies (e.g., Docker, Kubernetes) Demonstrated experience transforming manual processes into automated CI/CD pipelines. Proficiency with version control systems (Git) and an understanding of branching strategies. Hands-on experience with the Unix/Linux operating system and shell scripting What We Offer Opportunities to work with cutting-edge AI and automation technologies Exposure to critical aerospace, defense, and government projects Support critical infrastructure for aerospace and government applications Make a meaningful impact on national security and defense capabilities Competitive Compensation Access to Intel's world-class training and development programs Career advancement opportunities within a global technology leader Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Santa Clara, US, Oregon, HillsboroBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $117,620.00-227,270.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Are you passionate about creating seamless and efficient software solutions that bridge the gap between applications and systems? Join Intel's mission to shape the future of technology and help create a better world through groundbreaking innovations in AI, analytics, and cloud-to-edge technology. The Opportunity Intel's Foundry Automation organization (IFA) is seeking an experienced Software Application Development Engineer - Government Programs to join our dynamic Middleware team. You'll be at the forefront of engineering cutting-edge middleware stack solutions, working with technologies like Rest/gRPC, Apache Kafka and kafka streams on Cloud platforms. Why Intel? At Intel, your career isn't just about writing code-it's about powering the innovations that shape our world. You'll work alongside brilliant minds, tackle complex challenges, and see your contributions make a real difference in advancing technology for the greater good. Ready to help make the future more wonderful for everyone? Want to learn more about life at Intel? Visit our YouTube Channel In this role, you'll have the unique opportunity to contribute to critical government programs while advancing technology that powers major breakthroughs and enhances everyday quality of life for people around the world. What You'll Do Design and develop robust middleware solutions that seamlessly connect applications and systems Engineer scalable solutions using Apache Kafka, im ConnectRR, and im ConnectPS on im Cloud Collaborate with cross-functional teams to deliver high-impact software solutions Work on government programs that contribute to national security and technological advancement Leverage modern architectural frameworks and cloud-native technologies #cj Qualifications: Minimum Qualification U.S. Citizenship Ability to obtain and maintain US Government TS Security Clearance and SCI access Bachelor's degree in Computer Science with 3+ years of experience OR Master's degree in any STEM field with 2+ years of experience 2+ years of experience with C#/Java Development Preferred Qualifications: Active US Government TS/SCI Security Clearance Experience with REST/gRPC APIs, VB Script, DCOM, MSMQ, WCF, and web services Experience with Python, SQL, and shell scripting Microsoft solutions expertise Open-source package integration Modern architectural frameworks - Apache Kakfa and Kafka Streams Kubernetes ecosystem: deployments, GitHub CI/CD, Helm charts, Canary testing Cloud-native concepts: stateless/stateful workloads, PVC, Config-Maps, Secrets Authentication/Authorization technologies (OAuth) Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $100,550.00-194,270.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Intel's Foundry Automation group is seeking an experienced Software Application Development Engineer - Government Programs. Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Intel Foundry Automation (IFA) organization is seeking talented software engineers with expertise in architecting, designing, and developing end-to-end systems that ingest and route data from semiconductor factories and production equipment into factory automation and enterprise resource planning (ERP) systems and data stores. With a focus on Factory Data Systems (FDS), you will work closely with factory customers, enterprise planning teams and partner with multiple TD ATA teams to provide innovative solutions that transform Intel's business. You will be expected to lead and drive projects through the entire software development life cycle from requirements to implementation. The ideal candidate should exhibit the following behavioral traits and/or skills: Outstanding written and oral communication skills. Analytical problem solving and troubleshooting skills. Teamwork and collaboration skills. Tolerance of ambiguity and self-motivation. Ability to lead developers through the software development life cycle. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum qualification: U.S. citizenship required. Ability to obtain and maintain US Government TS Security Clearance and SCI access. Candidate must possess a BS with 2+ years of experience in Computer Science, Computer Engineering, or related STEM Field. 2+ years of experience in Microsoft development technologies (Visual Studio, C#). 2+ years of experience with middleware technologies (WCF, REST, JSON, etc.). 2+ years of experience in database development (Oracle, MS SQL, PostgreSQL, etc.) and data pipeline technologies. 2+ years of experience in working with user interface technologies (Angular, React, etc.) Preferred Qualifications: Active US Government TS/SCI Security Clearance. A MS degree with 1+ years of experience with a degree in Computer Science, Computer Engineering, or related STEM Field. Skilled in object-oriented software design and development. Analyzing new and evolving business requirements and mapping them to technical requirements. Experience in the following: Scripting language Python. Microsoft or Linux operating systems. Oracle or Microsoft database technologies or developing distributed systems are highly desired. Requirements listed would be obtained through a combination of industry relevant job experience, internship experience and/or schoolwork/classes/research. Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $100,550.00-194,270.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Intel's Foundry Automation (IFA) team is hiring a Software Application Development Engineer - Government Programs. As part of our team, you will partner with end users in Fab Manufacturing and Engineering to deliver innovative solutions specially crafted for the ever-changing needs of our highly automated factories. To integrate these solutions, you will work closely with our Software Development teams and execute testing, implementation, troubleshooting and documentation of business processes. As a key member of our team, you will operate in a high visibility role supporting 24/7 manufacturing capabilities. Primary functions include: Gathering requirements. Analyzing existing processes and procedures. Stakeholder management. Prioritizing configuration changes in manufacturing execution systems and managing projects that support development and continuous improvement. Join us - and set the standard for Data Management Systems. Key Responsibilities: Collaboration and engagement with internal customers/partners to identify emerging data/business needs and trends. Provide guidance and recommendations to mitigate and solve technical and manufacturing challenges. Execute implementation and testing of application/database software releases. Adapt and prioritize work based on the changing needs of the factory. Provide L3 end user support by participating in 24x7 on-call rotation. Co-develop tools/business processes that support efficiency. The candidate should also exhibit the following behavioral traits and/or skills: Proactive and willing to work in a dynamic and team-oriented environment. Enthusiastic collaborator and organizer and a self-starter. Collaborative and interpersonal skills, willing to influence and motivate others. Effectively communicate and articulate technical concepts in a clear and concise manner. Technical problem-solving skills. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum qualification: U.S. citizenship required. Ability to obtain and maintain US Government TS Security Clearance and SCI access. The Candidate must possess a BS degree with 3+ years of experience in Computer Science, Computer Engineering, or related STEM fields. 1+ years' experience with PL/SQL development. 1+ years' experience with Relational schema design development. Preferred Qualifications: Active US Government TS/SCI Security Clearance. Master's/Ph.D. degree in Computer Science, Computer Engineering, or related STEM fields. Oracle Certification (OCA, OCP, or OCM). Experience with Relational Data Systems (Oracle, MS-SQL, Postgres etc.). C# Programming Language. Agile Programming and DevOps Practices. Experience with Software/Systems Development Life Cycle (SDLC). LEAN methodologies. Experience with Business Process analysis and documentation. Experience with 24/7 manufacturing environment. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:US, Oregon, HillsboroBusiness group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $100,550.00-194,270.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Intel's Foundry Automation group is seeking an experienced Software Application Development Engineer - Government Programs. Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Intel Foundry Automation (IFA) organization is seeking talented software engineers with expertise in architecting, designing, and developing end-to-end systems that ingest and route data from semiconductor factories and production equipment into factory automation and enterprise resource planning (ERP) systems and data stores. With a focus on Factory Data Systems (FDS), you will work closely with factory customers, enterprise planning teams and partner with multiple TD ATA teams to provide innovative solutions that transform Intel's business. You will be expected to lead and drive projects through the entire software development life cycle from requirements to implementation. The ideal candidate should exhibit the following behavioral traits and/or skills: + Outstanding written and oral communication skills. + Analytical problem solving and troubleshooting skills. + Teamwork and collaboration skills. + Tolerance of ambiguity and self-motivation. + Ability to lead developers through the software development life cycle. **Qualifications:** Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. **Minimum qualification:** + U.S. citizenship required. + Ability to obtain and maintain US Government TS Security Clearance and SCI access. + Candidate must possess a BS with 2+ years of experience in Computer Science, Computer Engineering, or related STEM Field. + 2+ years of experience in Microsoft development technologies (Visual Studio, C#). + 2+ years of experience with middleware technologies (WCF, REST, JSON, etc.). + 2+ years of experience in database development (Oracle, MS SQL, PostgreSQL, etc.) and data pipeline technologies. + 2+ years of experience in working with user interface technologies (Angular, React, etc.) Preferred Qualifications: + Active US Government TS/SCI Security Clearance. + A MS degree with 1+ years of experience with a degree in Computer Science, Computer Engineering, or related STEM Field. + Skilled in object-oriented software design and development. + Analyzing new and evolving business requirements and mapping them to technical requirements. + Experience in the following: + Scripting language Python. + Microsoft or Linux operating systems. + Oracle or Microsoft database technologies or developing distributed systems are highly desired. Requirements listed would be obtained through a combination of industry relevant job experience, internship experience and/or schoolwork/classes/research. **Job Type:** Experienced Hire **Shift:** Shift 1 (United States of America) **Primary Location:** US, Arizona, Phoenix **Additional Locations:** **Business group:** Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. **Posting Statement:** All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. **Position of Trust** N/A **Benefits** We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel (*********************************************************************************** . Annual Salary Range for jobs which could be performed in the US: $100,550.00-194,270.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. **Work Model for this Role** This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Are you passionate about creating seamless and efficient software solutions that bridge the gap between applications and systems? Join Intel's mission to shape the future of technology and help create a better world through groundbreaking innovations in AI, analytics, and cloud-to-edge technology. **The Opportunity** Intel's Foundry Automation organization (IFA) is seeking an experienced Software Application Development Engineer - Government Programs to join our dynamic Middleware team. You'll be at the forefront of engineering cutting-edge middleware stack solutions, working with technologies like Rest/gRPC, Apache Kafka and kafka streams on Cloud platforms. **Why Intel?** At Intel, your career isn't just about writing code-it's about powering the innovations that shape our world. You'll work alongside brilliant minds, tackle complex challenges, and see your contributions make a real difference in advancing technology for the greater good. Ready to help make the future more wonderful for everyone? _Want to learn more about life at Intel? Visit our_ YouTube Channel (****************************** In this role, you'll have the unique opportunity to contribute to critical government programs while advancing technology that powers major breakthroughs and enhances everyday quality of life for people around the world. **What You'll Do** + Design and develop robust middleware solutions that seamlessly connect applications and systems + Engineer scalable solutions using Apache Kafka, im ConnectRR, and im ConnectPS on im Cloud + Collaborate with cross-functional teams to deliver high-impact software solutions + Work on government programs that contribute to national security and technological advancement + Leverage modern architectural frameworks and cloud-native technologies \#cj **Qualifications:** **Minimum Qualification** + U.S. Citizenship + Ability to obtain and maintain US Government TS Security Clearance and SCI access + Bachelor's degree in Computer Science with 3+ years of experience OR Master's degree in any STEM field with 2+ years of experience + 2+ years of experience with C#/Java Development **Preferred Qualifications:** + Active US Government TS/SCI Security Clearance + Experience with REST/gRPC APIs, VB Script, DCOM, MSMQ, WCF, and web services + Experience with Python, SQL, and shell scripting + Microsoft solutions expertise + Open-source package integration + Modern architectural frameworks - Apache Kakfa and Kafka Streams + Kubernetes ecosystem: deployments, GitHub CI/CD, Helm charts, Canary testing + Cloud-native concepts: stateless/stateful workloads, PVC, Config-Maps, Secrets + Authentication/Authorization technologies (OAuth) **Job Type:** Experienced Hire **Shift:** Shift 1 (United States of America) **Primary Location:** US, Arizona, Phoenix **Additional Locations:** **Business group:** Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth. **Posting Statement:** All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. **Position of Trust** N/A **Benefits** We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel (*********************************************************************************** . Annual Salary Range for jobs which could be performed in the US: $100,550.00-194,270.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. **Work Model for this Role** This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Foundry Services Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Position Overview We seek a highly motivated, results-driven Senior Silicon Applications Engineer (Packaging Design) to join our team within Intel Foundry Aerospace, Defense and Government (ADG). This role focuses on advanced packaging technologies, working closely with foundry customers to define, develop, and implement design tools, flows, and methodologies for system co-design, implementation, and verification. You will serve as the technical expert on packaging design tools while consulting on design and implementation challenges. Key Responsibilities Customer Technical Leadership Establish technical credibility, building trust and strong relationships with Intel Foundry ADG customers Ensure customers successfully evaluate, adopt, and design products using Intel process technology Serve as primary technical expert on packaging design tools and implementation methodologies Provide clear communications and technical guidance to customers and stakeholders Analyze customer design issues and environments to define functional specifications for EDA vendors Drive adoption of advanced packaging verification methodologies including signal integrity and power integrity Advanced Packaging Solutions Work closely with customers on advanced packaging technologies including multi-die/3DIC platforms Support design implementation and verification across complex packaging architectures Consult on packaging design challenges and provide innovative technical solutions Cross-Functional Collaboration Synthesize complex technical information and lead in-depth tactical discussions with customers Collaborate with Intel engineering teams to address customer requirements and technical challenges Support customer evaluations and design reviews for advanced packaging implementations Drive results through highly organized, analytical approach and strong teamwork Core Competencies Strong technical credibility and customer relationship building skills Highly organized, analytical mindset with strong team collaboration abilities Excellent communication skills for complex technical discussions Results-driven approach with ability to deliver customer success outcomes Qualifications: The Minimum qualifications are required to be considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications US Citizenship required Ability to obtain US Government Security Clearance Bachelor's degree in Electrical Engineering, Computer Engineering, or STEM-related field 7+ years of experience in Package Design and relevant EDA tools Experience interfacing with customers and/or stakeholders Experience analyzing customer design issues, environments, and defining functional specifications for EDA vendors Preferred Qualifications Active US Government Security Clearance with a minimum of Secret Level. Post-graduate degree in Electrical/Computer Engineering or STEM-related field Experience with Advanced EDA Tool Experience with Multi-die/3DIC Platform Tools: Cadence Integrity, Synopsys 3DIC Compiler, Siemens Xpedition Substrate Integrator/Innovator 3D Experience with Implementation Tools: Cadence Virtuoso/Innovus, Allegro (APD/SiP), Siemens Mentor Xpedition, Synopsys Fusion Compiler Experience with Verification Tools: Siemens Calibre, Synopsys ICV, Cadence Pegasus Experience with design for verification and performance including Package Signal Integrity, Power Integrity, manufacturing, and yield optimization Proficiency in scripting languages (Tcl, Python, SKILL, VBScript) for design flow automation and efficiency improvements Deep understanding of advanced packaging architectures and system-level design challenges What We Offer Opportunity to work on cutting-edge advanced packaging technologies for aerospace, defense, and government applications Direct customer engagement and technical leadership role Access to Intel's most advanced foundry technologies and EDA tool suites Competitive compensation Professional development in advanced packaging and foundry services Direct impact on Intel's foundry business growth and customer success Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Santa Clara, US, Oregon, HillsboroBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $164,470.00-311,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Foundry Services Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Position Overview The Aerospace, Defense & Government (ADG) Senior Analog/Mixed Signal Application Engineer specializing in Analog Mixed-Signal Design provides critical technical support to Intel Foundry Services customers on PDKs, design methodologies, and implementation flows. This role ensures successful customer tape-outs through expert guidance on analog/mixed-signal design challenges while driving quality improvements in design kits and documentation. Key Responsibilities Customer Technical Support & Collaboration Provide comprehensive tool/flow/methodology support to address customer analog mixed-signal design issues and challenges, ensuring successful tape-outs and maximum customer satisfaction Collaborate with internal Intel teams and external stakeholders including foundry customers' design teams, IP providers, and EDA vendors on AMS design and layout issue resolution Support customers through complex analog design challenges and advanced process technology adoption Technical Content Development & Training Create application notes, comprehensive documentation, and deliver technical training presentations to customers and internal teams Drive quality improvements in design kits and documentation to remove barriers to successful customer design tape-outs Develop best practice guidelines for analog mixed-signal design implementation across advanced CMOS processes Analog Design Methodology Leadership Provide technical direction on custom/analog mixed-signal design and layout methodologies Support analog tool flows including schematic entry, analog/RF simulation, extraction, post-layout simulation, and reliability validation Drive methodology improvements to streamline customer design workflows and enhance design productivity Core Competencies Self-driven and results-oriented with capability to effectively manage multiple tasks Strong analytical problem-solving skills for complex analog design challenges Effective communication skills with experience in collaboration, active listening, and providing constructive feedback Qualifications: Minimum Qualifications US Citizenship required Ability to obtain US Government Security Clearance Bachelor's degree in Electrical Engineering, Computer Engineering, or STEM-related field of study 5+ years of experience with advanced CMOS processes (16nm and below) 4+ years of experience in one or more of the following scripting languages (Python, Perl, Tcl, shell scripting) Hands-on experience in Design Implementation and methodology, specifically in Custom/Analog Mixed-Signal design/layout Preferred Qualifications Active US Government Security Clearance with a minimum of Secret level. Post Graduate degree in Electrical / Computer Engineering, Computer Science, or in a STEM related field of study. Experience with providing technical direction to engineering teams, including but not limited to customer support, driving methodologies to streamline design work. Hands-on experience with analog tool and flows: Schematic entry, analog/RF simulation, extraction, post layout simulation, reliability validation. Hands on experience with custom layout of analog blocks and Layout migration b/w different advanced FINFET tech nodes. Experience in design of RF/analog/mixed-signal blocks: Low-noise amplifiers, filters, mixers, VCO, PLL, clock recovery, clock distribution, ADC/DAC, etc. Customer facing experience. Experience in SOTA Process technology (7nm and below) and PDK based technology evaluation. Experience with thermal analysis at the block and die level using tools such as Ansys Icepak and/or Cadence Celsius What We Offer Opportunity to work with cutting-edge analog mixed-signal technologies for aerospace, defense, and government applications Direct customer engagement and technical leadership in advanced semiconductor design Access to Intel's most advanced foundry technologies and comprehensive analog design tool suites Competitive compensation Professional development in analog design methodologies and foundry services Direct impact on national security through advanced analog semiconductor solutions Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Santa Clara, US, Oregon, HillsboroBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $141,910.00-269,100.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Foundry Services Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Position Overview The Aerospace, Defense & Government (ADG) Memory Design Application Engineer provides specialized technical support to Intel Foundry Services customers on memory compiler generation and integration challenges. This critical role ensures successful customer tape-outs by resolving complex memory IP integration issues, driving quality improvements in memory collaterals, and delivering comprehensive technical guidance on memory design methodologies for advanced semiconductor applications. Key Responsibilities Memory IP Technical Support & Integration Provide comprehensive technical support to Intel Foundry Services customers on memory compiler generation and integration issues Collaborate with internal Intel teams and external stakeholders including foundry customers' design teams, Memory IP providers, and EDA vendors on foundational IP integration issue resolution Drive resolution of customer issues related to memory IP collaterals, ensuring seamless integration and optimal performance Technical Content Development & Training Create application notes, comprehensive documentation, and deliver technical training presentations to customers and internal teams Drive quality improvements in design kits, Memory IP collaterals, and documentation to remove barriers to successful customer design tape-outs Develop best practice guidelines for memory integration across advanced process technologies and customer applications Memory Design Methodology & Problem Solving Lead debugging and problem-solving activities in collaborative team environments Provide technical expertise on memory compiler design, generation, and optimization Support customers through complex memory design challenges and advanced integration requirements Drive methodology improvements to enhance memory design productivity and reliability Customer Engagement & Technical Excellence Deliver customer-facing technical support with focus on memory design and integration solutions Ensure maximum customer satisfaction through expert guidance on memory IP implementation Support aerospace, defense, and government customers with specialized memory requirements and security considerations Core Competencies Self-driven and results-oriented with capability to effectively manage multiple complex tasks Effective communicator with strong interpersonal and leadership capabilities, fostering collaboration across cross-functional teams and providing constructive feedback Qualifications: The Minimum qualifications are required to be considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Minimum Qualifications US Citizenship required Ability to obtain a US Government Security Clearance Bachelor's degree in Electrical Engineering, Computer Science, or in a STEM related field of study 3+ years of experience with Memory design or Memory Compiler development and implementation Preferred Qualifications: Active US Government Security Clearance with a minimum of Secret level Post Graduate degree in Electrical Engineering, Computer Science, or in a STEM related field of study Proficient in common memory types, including SRAM, Register Files (RF), and ROM, with a solid understanding of CMOS digital circuit design principles Knowledgeable in both behavioral and physical modeling of memory architectures, supporting accurate simulation and verification Hands-on experience with customer support in at least one of the following domains: Memory Design, Memory Compiler Design, eFUSE and anti FUSE and MBIST Experience with IP development is a strong plus Proficient in scripting languages like Perl/Tcl/Python, and power-aware RTL and UPF flow is a plus Experience in ASIC or SoC development What We Offer Opportunity to work with cutting-edge memory technologies for aerospace, defense, and government applications Direct customer engagement and technical leadership in advanced memory design Access to Intel's most advanced foundry technologies and comprehensive memory IP portfolio Competitive compensation Professional development in memory design methodologies and foundry services Direct impact on national security through advanced memory semiconductor solutions Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Santa Clara, US, Oregon, HillsboroBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Foundry Services Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Position Overview We seek a DFT Application Engineer to provide technical support to Intel Foundry Services customers on PDKs, DFT/DFM insertion, and ATPG validation methodologies. This critical role supports Aerospace, Defense, and Government (ADG) customers in achieving successful tape-outs while ensuring the highest quality standards through comprehensive DFT solutions and customer engagement. Key Responsibilities Customer Technical Support & Collaboration Provide comprehensive DFT tool/flow/methodology support to address customer issues and challenges, ensuring successful tape-outs and maximum customer satisfaction Work closely with internal Intel teams and external stakeholders including foundry customers' design teams, IP providers, and EDA vendors to resolve complex technical issues Deliver customer-facing technical support and guidance on DFT implementation strategies DFT Methodology & Quality Leadership Drive quality improvements in ASIC DFT/DFM and ATPG validation methodology, capability/flow, and documentation for both block-level and SoC-level implementations Collaborate with RTL and Hard IP designers on DFT/DFM implementation methodology and work with physical designers on DFT/DFM physical implementation, validation, and timing signoff Develop and optimize DFT insertion flows for advanced CMOS processes and multi-die designs Technical Content Development & Training Develop application notes, comprehensive documentation, and deliver technical training presentations to customers and internal teams Create best practice guidelines and methodology documentation for DFT implementation across various design complexities Support knowledge transfer and capability building for both internal teams and customer organizations Essential Skills & Attributes Customer-Focused: Strong customer-oriented attitude and mindset with commitment to customer success Self-Motivated: Self-driven and results-oriented with ability to manage multiple complex tasks effectively Collaborative: Excellent teamwork skills to drive innovative solutions for customer design implementation challenges Analytical: Strong analytical problem-solving capabilities for complex DFT challenges Communication: Effective communication skills with experience in collaboration, active listening, and providing constructive technical feedback Qualifications: The Minimum qualifications are required to be considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications US Citizenship required Ability to obtain US Government Security Clearance Bachelor's degree in Electrical Engineering, Computer Engineering, or STEM-related field 3+ years of experience with advanced CMOS processes (22nm and below) 3+ years of combined experience in the following: implementing ASIC DFT/DFM insertion (MBIST, LBIST, SCAN, JTAG) at both ASIC design block level and full chip level, including ATPG validation and DFT timing/signoff at SOC level 2+ years of experience in one or more of the following scripting languages (Python, Perl, Tcl, and/or shell scripting) Preferred Qualifications Active US Government Security Clearance with a minimum of Secret Level. Post-graduate degree in Electrical/Computer Engineering or STEM-related field Hands-on experience in Design Implementation and methodology (ASIC design, Fullchip Integration, Design Signoff, LVS, DRC, DFX/DFM, Reliability Proficiency with major EDA tools for MBIST insertion, hierarchical SCAN and JTAG insertion, DFT constraint generation and ATPG validation for single die and multi-die designs Experience building/developing quality DFT/DFX insertion flow and ATPG validation flow Experience providing technical direction to engineering teams and customer support Customer-facing experience in technical roles Experience with state-of-the-art process technology (7nm and below) and PDK-based technology evaluation What We Offer Opportunity to work with cutting-edge DFT technologies for aerospace, defense, and government applications Direct customer engagement and technical leadership in advanced semiconductor design Access to Intel's most advanced foundry technologies and comprehensive EDA tool suites Competitive compensation Professional development in DFT methodologies and foundry services Direct impact on national security through advanced semiconductor technology solutions Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Santa Clara, US, Oregon, HillsboroBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Foundry Services Intel Foundry is a systems foundry dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. With a focus on scalability, AI advancement, and shaping the future, we provide an unparalleled blend of an industry-leading technology, a rich IP portfolio, a world-class design ecosystem, and an operationally resilient global manufacturing supply chain. Position Overview The Aerospace, Defense & Government (ADG) IP Enablement Application Engineer provides comprehensive technical support to Intel Foundry Services customers on IP integration challenges. This dynamic role requires a versatile engineer who engages with IP design teams and internal/external customers across all phases of IP development - from architecture through post-silicon validation and debug. The position embodies customer obsession by quickly resolving issues and providing hands-on debug across all design domains. Key Responsibilities IP Integration & Customer Support Provide comprehensive technical support to Intel Foundry Services customers on IP integration issues, working independently with design teams and customers to solve complex challenges remotely or onsite Fully own assigned IPs and work with internal and external customers to help them integrate Intel IPs into SoCs, providing expert technical support throughout the integration process Drive resolution of customer issues related to IP collaterals generation, logic design verification, IP release, and integration in SoC environments Cross-Functional Collaboration & IP Development Work with cross-functional teams to develop SoC and IP integration methodologies and best practices Engage with IP development teams to ensure all IP collaterals are generated and provided according to customer requirements and industry standards Collaborate with internal teams across Intel and external stakeholders including foundry customers' design teams, IP providers, and EDA vendors on foundational IP integration issue resolution Customer Requirements & Training Engage in upfront identification and documentation of customer requirements, working with IP design teams to disposition and address requests Prepare comprehensive customer training materials and provide training on IP architecture, specifications, and fuse/register settings to enable effective debug Create application notes, documentation, and deliver technical training presentations to customers and internal teams Quality & Process Improvement Drive quality improvements in design kits and documentation, assisting in removing barriers to successful customer design tape-outs Support debugging and problem-solving activities in collaborative team environments Contribute to methodology improvements that enhance IP integration productivity and customer satisfaction Core Competencies Strong technical problem-solving and debugging capabilities Ability to work independently and manage customer relationships effectively Excellent communication skills for technical training and customer support Willingness to travel to customer sites as required Qualifications: The Minimum qualifications are required to be considered for this position. Minimum qualifications listed below would be obtained through a combination of industry relevant job experience, internship experience and / or schoolwork/classes/research. The preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates Minimum Qualifications US Citizenship required Ability to obtain a US Government Security Clearance Bachelor's degree in Electrical Engineering, Computer Science, or in a STEM related field of study 2+ years of experience in SOC IP Integration 3+ years of combined experience in RTL design and DFT using Verilog/System Verilog Experience in ASIC or SoC development Preferred Qualifications: Active US Government Security Clearance with a minimum of Secret level Post Graduate degree in Electrical Engineering, Computer Science, or in a STEM related field of study Experience with one or more industry standard IO interfaces including (ADPLL, GPIO, Digital Thermal Sensors, DDR, LPDDR, PCIE, USB, USB TypeC, Ethernet, etc.) Experience with VCS, Verdi, Spyglass or equivalent tools Experience with IP integration and design flow challenges within the context of subsystems and SOCs Experience with IP development Experience in scripting languages like such as Perl/Tcl/ and Python What We Offer Opportunity to work with cutting-edge memory technologies for aerospace, defense, and government applications Direct customer engagement and technical leadership in advanced memory design Access to Intel's most advanced foundry technologies and comprehensive memory IP portfolio Competitive compensation Professional development in memory design methodologies and foundry services Direct impact on national security through advanced memory semiconductor solutions Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:US, California, Santa Clara, US, Oregon, HillsboroBusiness group:The Central Engineering Group (CEG) is Intel's data-driven organization that builds scalable engineering solutions across three pillars: Product Enablement (IP, tools, and methodologies), Custom ASIC (leveraging existing IP for custom silicon), and Foundry Enablement (supporting top customers and validating technologies). The team focuses on customer-driven, end-to-end solutions with short development cycles to deliver measurable business impact across Intel's product and foundry businesses.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $122,440.00-232,190.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: The Advanced Packaging Technology Manufacturing (APTM) division at Intel is responsible for the development and commercialization of industry-leading semiconductor packaging technologies for mobile, edge, and hyperscale computing platforms. Within APTM, the Assembly Technology Development (ATD) team pioneers innovative package assembly solutions and scales them for high-volume manufacturing. The Packaging Module Development Engineer will contribute to advancing technology and foundry capabilities by: Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms. Collaborating with multifunctional and cross-organizational teams to optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability. Innovating next generation materials, equipment, and fabrication processes to enhance semiconductor packaging capabilities at scale. Managing projects to meet product development timelines. Applying formal education and judgment to solve technical problems. Providing sustaining support for equipment performance and process health in high-volume manufacturing. Responding promptly to foundry customer requests and events. The ideal candidate will demonstrate: Technical leadership, strategic planning, and critical thinking. Ability to coach and develop technical teams. Tolerance for ambiguity and adaptability in a dynamic environment. Flexibility in managing changing priorities and responsibilities. Experience leading teams in a highly matrixed organization. Initiative and ability to work independently. Strong communication, influencing, technical, and analytical skills. This position requires regular onsite presence. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum qualifications and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your schoolwork, classes, research, relevant previous job, and/or internship experiences. Minimum Qualifications: PhD with one or more years in Materials Science, Mechanical Engineering, Electrical Engineering, Physics/Applied Physics, or a related field. Minimum GPA of 3.5. At least one publication in a peer-reviewed technical journal. Must have the required degree prior to your start date. Preferred Qualifications: One or more years of experience in any of the following: Technology development, including familiarity with Statistical Process Control (SPC) and/or Design of Experiments (DOE). Delivering results for complex, time-critical technical projects. Semiconductor fabrication processes and technology. Previous related work experience in a semiconductor foundry. Job Type:College GradShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

As a senior member of Intel's Thermal Mechanical Engineering team, you will lead the development of advanced thermal and mechanical solutions for Data Center CPUs-spanning silicon, system, and datacenter levels. This role requires deep technical expertise, strong collaboration skills, and the ability to thrive in a fast-paced environment. Key Responsibilities: * Define product power and temperature limits based on system cooling capabilities. * Provide thermal parameters for manufacturing teams. * Conduct thermal analysis, design, prototyping, and testing of air and liquid cooling solutions. * Apply expertise in conduction, convection, radiation, heat sinks, heat pipes, and vapor chambers. * Perform thermal and pressure drop characterization and validate models. * Optimize thermal management systems, including materials, contact pressure, and firmware policies. * Simulate thermal behavior from silicon to PCB, considering materials, layout, and transient effects. * Lead thermal design reviews and resolve technical issues. * Collaborate cross-functionally with design, power, reliability, electrical, and mechanical teams. * Drive technical readiness through research, experiments, and prototyping. Additional Responsibilities: * Serve as a domain expert influencing technical direction across Intel and the industry. * Mentor technical leaders and promote Intel values. * Formulate technical strategy aligned with organizational goals and deliver leadership solutions. * Drive innovation in modeling, simulation, and automation to accelerate design cycles. * Analyze performance, power, and thermal characteristics to guide design trade-offs. * Lead teams in detailed design, testing, and prototype fabrication. Qualifications: Qualifications: Minimum Requirements: * Bachelor's degree in Mechanical Engineering or related field with 10+ years of related experience * 8+ years of experience in: * Heat transfer fundamentals for data center or client systems. * Thermal testing techniques using sensors and wind tunnels. * Thermal simulation software (Flotherm, Icepak). * CFD tools and thermal modeling processes Preferred Qualifications: * Advanced degree (MS/PhD) in Mechanical Engineering with focus on Heat Transfer, Fluid Dynamics, and Electronics Cooling. * Proficiency in Python, MATLAB, LabVIEW, and statistical analysis. * Hands-on experience with thermal metrology, DOE, instrumentation, and uncertainty analysis. * Strong project leadership and cross-functional collaboration skills. * Expertise in electronics cooling for systems/platforms, racks, and datacenters. * Deep knowledge of TIMs, heat sinks, vapor chambers, heat pipes, fans, and liquid cooling systems. * CAD proficiency (SolidWorks or Creo) and CFD experience. * Experience managing ODMs/vendors and full product lifecycle from concept to production. * Familiarity with acoustic testing, DFM, and high-volume manufacturing. * Ability to integrate novel thermal technologies aligned with Intel's roadmap. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix Business group: At the Data Center Group (DCG), we're committed to delivering exceptional products and delighting our customers. We offer both broad-market Xeon-based solutions and custom x86-based products, ensuring tailored innovation for diverse needs across general-purpose compute, web services, HPC, and AI-accelerated systems. Our charter encompasses defining business strategy and roadmaps, product management, developing ecosystems and business opportunities, delivering strong financial performance, and reinvigorating x86 leadership. Join us as we transform the data center segment through workload driven leadership products and close collaboration with our partners. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

About the Group: Central Engineering Group (CEG) oversees all test chip design, all foundational and hard IP, all EDA and design platform functions for Intel Products, as well as all external IP and EDA commercial licensing. The Central Engineering group is also responsible for delivering industry-leading Custom Silicon Solutions for Intel Customers in the Client and Hyperscaler Domains. About the Role: Intel's Central Engineering Group is seeking a Silicon Packaging Architect, responsible for bridging silicon design and advanced packaging to deliver high-performance, cost-effective solutions for next-generation SOCs and DDR PHY interfaces. Key Responsibilities: * Lead the co-design of silicon and package, focusing on DDR PHY and mixed signal IP integration for server SOCs. * Design bump maps, floor plans, and manage area constraints for PHYs, collaborating closely with packaging technical experts. * Conduct hands-on package extractions and simulations (signal integrity, power integrity) to assess package trace and electrical impacts, and perform risk assessments for bump-out strategies. * Finalize bump-out, floor plan, and area decisions at the end of tech readiness phases. * Interface with packaging teams on advanced technologies (e.g., C4 bumps, micro bumps, EMIB, hybrid bonding as needed). * Focus on design, development, and architecture, not process or materials engineering. Required Experience: * Experience in both silicon design (preferably mixed signal/analog) and packaging co-design. * Background in DDR, SOC, or similar high-speed interface development. * Hands-on expertise with bump mapping, floor planning, and packaging constraints. * Proven ability to collaborate across silicon and packaging teams, including risk assessment and simulation. * Familiarity with advanced packaging technologies (hybrid bonding, EMIB, etc.) is a plus but not required. * Individual contributor or principal engineer level preferred; management experience is not required. * Experience at leading companies in advanced packaging and PHY design (e.g., Apple, Broadcom, Qualcomm, Micron, AMD, Nvidia). Qualifications: * Bachelors in electrical engineering, chemical engineering, mechanical engineering, material science or similar field (Master's or Ph.D. preferred). * 10+ years in silicon and packaging co-design Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, California, Folsom Additional Locations: US, Arizona, Phoenix, US, California, Santa Clara, US, Oregon, Hillsboro Business group: The Silicon Engineering Group (SIG) is a worldwide organization focused on the development and integration of SOCs, Cores, and critical IPs from architecture to manufacturing readiness that power Intel's leadership products. This business group leverages an incomparable mix of experts with different backgrounds, cultures, perspectives, and experiences to unleash the most innovative, amazing, and exciting computing experiences. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $220,920.00-311,890.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

Job Details:Job Description: Note: This role requires regular onsite presence to fulfill essential job responsibilities. Develops media and collaterals for assembly processes and/or equipment and applies novel concepts for innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Optimizes and improves the efficiency of manufacturing of media and collaterals, developing improvements to meet quality, reliability, cost, yield, productivity and manufacturability requirements. Develops media and collateral specifications applying principles for design of experiments and data analysis, and documents improvements through white papers. Develops and maintains equipment to evaluate media and collateral solutions under simulated field use conditions, such as heat, humidity, vibration, temperature cycle, and dynamic forces. Develops new techniques and acceleration methods, tools, and quality screens to ensure the early identification of potential problems with media and collateral quality and reliability. Performs and influences media and collateral design, material selection and prototype development to meet assembly module needs, based on fundamental understanding of failure mechanisms. Provides consultation concerning design problems and improvements in the assembly packaging process, and responds to customer/client requests or events as they occur. Delivers standardization in media and collateral qualification, manufacturing prototypes, and methods and continuously engages with packaging technology development and partner engineering groups on process/technology maturity for products towards key risk areas in meeting product milestones Qualifications:Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: •Possess a BS/MS/PhD degree in Mechanical Engineering/Material Engineering/Electrical Engineering/Physics related field. •Minimum 6 months of experience in fundamental science and engineering concepts in development to create novel solutions, including strong knowledge of Statistical Process Control (SPC) and/or Design of Experiments (DOE) principles. Preferred Qualifications: • Strong mechanical design software experience (SolidWorks, AutoCAD, etc) • Portfolio of self-completed project examples from concept to fabrication • Assembly equipment, process, media, and/or collateral experience • Technical innovation and deliver results for complex, time critical technical projects. • Understanding of semiconductor fabrication processes and technology with technical and analytical skills. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.Job Type:Experienced HireShift:Shift 1 (United States of America) Primary Location: US, Arizona, PhoenixAdditional Locations:Business group:Intel Foundry strives to make every facet of semiconductor manufacturing state-of-the-art while delighting our customers -- from delivering cutting-edge silicon process and packaging technology leadership for the AI era, enabling our customers to design leadership products, global manufacturing scale and supply chain, through the continuous yield improvements to advanced packaging all the way to final test and assembly. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments. Employees in the Foundry Technology Manufacturing are part of a worldwide factory network that designs, develops, manufactures, and assembly/test packages the compute devices to improve the lives of every person on Earth.Posting Statement:All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.Position of TrustN/ABenefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $115,110.00-162,500.00 USDThe range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

AI software framework group is responsible for development of all the AI Frameworks to enable Intel's AI HW roadmap. This group focus on developing AI software from kernel (such as matrix multiplication) to higher level frameworks (such as Inference engine). This group works closely with other Intel groups (such as lower-level stacks close to operating systems and higher-level stacks for cluster level scheduling) so that End to End software stack is developed for Intel hardware roadmap. This position, you will be responsible for prototyping, developing of GPU kernel, integrating to AI frameworks, and optimizing them for Intel hardware platforms. Designs, develops, integrates, tests, validates, and/or debugs software to enable Intel product features to enable or utilize Artificial Intelligence, including machine learning and deep learning. Understands internal and external partner software and develops software across the stack (spanning firmware, drivers, OS, middleware, frameworks, algorithms, and applications) as required to enable and optimize specific AI features, capabilities, solutions, reference platforms, or Intel products. May include the development of reference AI software and improving or enabling customer designs to obtain the greatest value of Intel AI products, the development and/or optimization of workloads for AI benchmarks, and workloads for simulation to support pre Si power and performance analysis and architecture recommendations. As a principal engineer, recognized as a domain expert who influences and drives technical direction across Intel and industry. Develops and mentors other technical leaders, grows the community, acts as a change agent, and role models Intel values. Aligns organizational goals with technical vision, formulates technical strategy to deliver leadership solutions, and demonstrates a track record of relentless execution in bringing products and technologies to market. Qualifications: Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: * 3 Years experience -GPU software architecture * 1 years experience - GPU Kernel Developments * 5 Yrs of experience in complex C++ based development and meta level programming Preferred Qualifications: * AI kernel developments (such as flash attention, MoE) * Understanding of overall AI SW stack * Understanding of PyTorch architecture * Ability to understand the complex requirements and lead large team of engineers with clear direction. * Demonstrated to adhere to specific timelines and deliver quality SW product * Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research. Job Type: Experienced Hire Shift: Shift 1 (United States of America) Primary Location: US, Oregon, Hillsboro Additional Locations: US, Arizona, Phoenix, US, California, Folsom, US, California, Santa Clara Business group: As a member of the Chief Technology Office, Artificial Intelligence, and Network and Edge Group (CTO AI NEX), you will be committed to strategically penetrating the AI market by delivering disruptive and transformative solutions. Your focus will be on leveraging technology innovation and incubation to drive commercial success, ensuring that advancements create significant value. The team is dedicated to driving the software-defined transformation of the world's networks profitably, setting new standards for efficiency and connectivity. Through these priorities, you aim to lead the way in technological evolution and redefine the future of global networks. Posting Statement: All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance. Position of Trust This role is a Position of Trust. Should you accept this position, you must consent to and pass an extended Background Investigation, which includes (subject to country law), extended education, SEC sanctions, and additional criminal and civil checks. For internals, this investigation may or may not be completed prior to starting the position. For additional questions, please contact your Recruiter. Benefits We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation. Find out more about the benefits of working at Intel. Annual Salary Range for jobs which could be performed in the US: $255,850.00-361,200.00 USD The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process. Work Model for this Role This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.

AMHS Principal Engineer TSMC is the world's leading semiconductor foundry, pioneering advanced chip manufacturing technologies that power the future of electronics. Our cutting-edge 4-nanometer fab in Phoenix, Arizona represents our commitment to expanding US-based semiconductor production and technological innovation. Our employees must demonstrate a strong sense of reliability and enthusiasm and possess an attitude that embodies our core values - Integrity, Commitment, Innovation and Customer Trust. Job Summary As an AMHS Principal Engineer, you will be part of a senior role dedicated to solving complex construction challenges in automated material handling systems. This role involves overseeing the construction and installation of different AMHS (Automated Material Handling System) cutting-edge systems and related control software. The ideal candidate for this role must have strong technical capability and possess excellent verbal and written communication. Must be data driven and have strong project management capabilities to support AMHS installation and construction projects. The responsibilities also include vendor management and coordination to ensure projects are completed timely and accurately. Essential Functions The AMHS Principal Engineer will perform various duties, including, but not limited to, the following: Vendor Management & Technical Leadership Oversee Vendor Management: Ensure the successful installation, integration, and ongoing maintenance of AMHS hookups in support of TSMC's factory ramp-up initiatives Monitor compliance with TSMC safety standards, OSHA regulations, and adherence to efficient material management practices Lead a small team to manage different technical projects Coordinate and oversee vendor activities to ensure performance optimization and meet project timelines Review Technical Documentation and Provide Feedback: Conduct in-depth reviews of technical specifications and deliver constructive feedback to equipment suppliers to drive enhancements, particularly in error recovery procedures Collaborate with manufacturing sites to sustain high-performance AMHS operations and disseminate best practices Project Planning & Execution Develop Comprehensive Project Plans: Lead the development of detailed project plans specific to the AMHS system, including defining timelines, milestones, deliverables, and cost structures, while ensuring alignment with organizational priorities and factory ramp schedules Monitor AMHS Project Progress and Performance: Regularly track and assess the progress of AMHS-related initiatives, proactively identifying potential bottlenecks, risks, or resource gaps Escalate critical concerns to senior stakeholders or project sponsors as necessary to ensure seamless execution Manage Dynamic Priorities and Multiple Projects: Demonstrate agility by managing shifting priorities in a high-paced environment Lead multiple concurrent AMHS-related projects with potentially overlapping deadlines, ensuring on-time delivery of all commitments without compromising quality Cross-Functional Collaboration & Integration Facilitate Cross-Organizational Collaboration: Partner with cross-functional teams across engineering, operations, and manufacturing to define and deliver AMHS project objectives, ensuring alignment on scope, resources, and timelines Foster open communication to streamline inter-departmental workflows Drive Integration and Workflow Optimization: Coordinate with key internal and external stakeholders to ensure the smooth integration of AMHS systems into broader project deliverables Continuously evaluate AMHS workflows and identify process improvement opportunities to enhance operational efficiency Risk Mitigation and Resolution: Identify and analyze risks specifically related to AMHS operations and implementation that could impact project success Implement mitigation strategies and facilitate consistent communication between stakeholders to ensure a proactive approach to risk management Required Qualifications Applicants must be legally eligible to work in the United States Bachelor's degree or higher in Electrical Engineering, Mechanical Engineering, Automation Engineering, Construction Engineering, Building Science, Construction Science, or Civil Engineering 5+ years of experience in automated material handling systems, industrial automation, or robotics or similar higher technology manufacturing equipment Proven track record of leading technical aspects of large-scale AMHS deployments, constructions, and optimization projects Hands-on experience with AMHS solutions in sectors such as logistics, semiconductor manufacturing, or warehousing automation Strong mechanical aptitude, project management experience, and system design proficiency, with the ability to manage multiple projects simultaneously Exceptional communication and interpersonal abilities to effectively collaborate within cross-functional and geographically dispersed teams Proven ability to prioritize tasks in response to changing business needs, multitask effectively, and perform as a team player in dynamic, fast-paced environments Proficiency in Excel, MS Project, SQL, Power BI and Microsoft PowerPoint Strong organizational skills and attention to detail Willingness to take on additional responsibilities as required to support evolving business priorities Working Environment Physical Requirements Ability to work in a clean room environment wearing proper clean room garments (full cleanroom suit, protective eyewear, gloves, hood, and mask) Must be able to work with computers extensively while remaining sedentary in an office environment throughout the shift Visual acuity for reading technical documents and analyzing data Manual dexterity for operating tools and equipment Experience with equipment such as ladders, scaffolding, or elevated work platforms. Ability to Walk Long Distances: This role involves walking long distance between different construction areas and fabs. The position requires the ability to work safely and effectively at heights of approximately 6 feet or more as needed during assigned tasks Comfortable and physically able to perform duties requiring standing, bending, and reaching while elevated Work environment may involve noisy or high-risk settings in industrial or manufacturing facilities Benefits As a valued member of the TSMC family, we place a significant focus on your health and well-being. When you are at your best-physically, mentally, and financially-our company is at its best. We offer a comprehensive and competitive benefits program that provides the resources you need to help you manage your health and achieve your goals across many areas of your life, including: Variety of medical, dental and vision plan offerings Income-protection programs for injury or illness 401(k)-retirement savings plan Competitive paid time-off programs and paid holidays Work Location: 5088 W. Innovation Circle, Phoenix, AZ 85083 Training Location: Onsite in Phoenix, AZ TSMC is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees. All qualified applicants will receive consideration for employment without regard to race, color, religion, age, sex, sexual orientation, gender identity, national origin, disability, veteran status, or any other protected characteristic. We encourage all qualified individuals to apply and welcome applications from diverse backgrounds and experiences. Candidates must be able to perform the essential functions of the job with or without reasonable accommodation. If you need an accommodation as part of the application process, please contact P_************. #LI-Onsite

Are you looking for a unique opportunity to be a part of something great? Want to join a 17,000-member team that works on the technology that powers the world around us? Looking for an atmosphere of trust, empowerment, respect, diversity, and communication? How about an opportunity to own a piece of a multi-billion dollar (with a B!) global organization? We offer all that and more at Microchip Technology Inc. People come to work at Microchip because we help design the technology that runs the world. They stay because our culture supports their growth and stability. They are challenged and driven by an incredible array of products and solutions with unlimited career potential. Microchip's nationally-recognized Leadership Passage Programs support career growth where we proudly enroll over a thousand people annually. We take pride in our commitment to employee development, values-based decision making, and strong sense of community, driven by our Vision, Mission, and 11 Guiding Values; we affectionately refer to it as the Aggregate System and it's won us countless awards for diversity and workplace excellence. Our company is built by dedicated team players who love to challenge the status quo; we did not achieve record revenue and over 30 years of quarterly profitability without a great team dedicated to empowering innovation. People like you. Visit our careers page to see what exciting opportunities and company perks await! Job Description: Microchip is seeking an entry level Wireless Systems Applications Engineer to provide customer support and develop sample applications for embedded wireless controllers and SoC products. Key Responsibilities: * Develop innovative solutions to address design challenges and issues reported by global clients. * Collaborate with internal engineering teams and fellow applications engineers to implement new features and optimize solutions. * Create technical resources including knowledge base articles, application notes, training presentations, and instructional videos to educate customers and internal teams. * Design and develop demo applications and sample projects showcasing real-world use cases of wireless products in embedded systems. * Validate, test, and release SDKs and software framework packages to ensure high quality and reliability. Requirements/Qualifications: * Bachelor's degree in Electrical Engineering, Computer Engineering, or Computer Systems Engineering with 2.5 years of experience in wireless embedded systems design and development or a Master's degree in Electrical Engineering, Computer Engineering, Computer Systems Engineering. * Strong programming skills in embedded C; experience with Python and Linux is a plus. * Familiarity with microcontroller-based system development. * Excellent verbal and written communication skills in English. * Exposure to one or more of the following technologies is a plus: Wi-Fi, Bluetooth, JIRA, Confluence, and source control tools (Git, SVN, etc.). Travel Time: 0% - 25% Physical Attributes: Hearing, Seeing, Talking Physical Requirements: 80% sitting, 10% walking, 10% standing Pay Range: We offer a total compensation package that ranks among the best in the industry. It consists of competitive base pay, restricted stock units, and quarterly bonus payments. In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature. Find more information about all our benefits at the link below: Benefits of working at Microchip The annual base salary range for this position, which could be performed in the US, is $70,304 - $143,000.* * Range is dependent on numerous factors including job location, skills and experience. Microchip Technology Inc is an equal opportunity/affirmative action employer. All qualified applicants will receive consideration for employment without regard to sex, gender identity, sexual orientation, race, color, religion, national origin, disability, protected Veteran status, age, or any other characteristic protected by law. For more information on applicable equal employment regulations, please refer to the Know Your Rights: Workplace Discrimination is Illegal Poster. To all recruitment agencies: Microchip Technology Inc. does not accept unsolicited agency resumes. Please do not forward resumes to our recruiting team or other Microchip employees. Microchip is not responsible for any fees related to unsolicited resumes.