GlobalWafers history

In 1991 it became the first company to add commercial production of 300mm wafers, and in that same year it developed the first process using granular polysilicon, which provided cost and productivity advantages over the traditional "chunk" polysilicon, especially in the production of 300mm wafers.

In 1994 MEMC joined forces with China Steel and other companies to create Taisil Electronic Materials, Inc., located in Taiwan to serve that country's semiconductor needs.

MEMC went public in 1995, completing an initial public offering (IPO) of stock in July of that year, raising more than $440 million.

Sales reached $1.12 billion in 1996, producing a profit of $101.6 million for MEMC, but a year later sales dipped to $986.7 million and the company recorded a loss of $6.7 million.

Revenues fell off another 23 percent in 1998 to $759 million and the company lost $316.3 million.

1999 – GlobiTech formed by a core management team with extensive experience in silicon and epi wafer manufacturing.

2000 – Construction started on GlobiTech’s headquarters and manufacturing facility.

First customer qualification in July 2001.

One of the first changes Texas Pacific made was to restructure MEMC's debt, a move that had a significant impact in 2002 when MEMC began to stage an impressive comeback.

2005 – GlobiTech achieves qualification of 10th Tier 1 semiconductor OEM.

2006 – GlobiTech exceeds 1 million wafers shipped.

2008 – GlobiTech purchased by Sino American Silicon.