American Power Conversion competitors

Patrick Paul Gelsinger (born 1961) is an American business executive and engineer, currently serving as CEO of Intel.

Arvind Krishna (born 1962) is an Indian-American business executive serving as Chairman and CEO of IBM. He has been the CEO of IBM since April 2020 and took on the role of Chairman & CEO in January 2021. Krishna began his career at IBM in 1990, at IBM's Thomas J. Watson Research Center, and was promoted to Senior Vice President in 2015, managing IBM Cloud & Cognitive Software and IBM Research divisions. He was a principal architect of the acquisition of Red Hat, the largest acquisition in the Company’s history.

Tunç Doluca joined Maxim in 1984 as a Member of Technical Staff. Tunç has personally designed over 40 products and holds 11 patents. In 1993, he was named the company's Vice President of R&D. In 1994, he became the founding General Manager of the Portable Power Business Unit. By 2005, Tunç’s responsibilities had expanded to managing seven business units and he was promoted to Group President. In 2007, Tunç became the second Chief Executive Officer in the company’s history. During his tenure as CEO, Maxim reorganized product development around end markets and completed six strategic acquisitions. Tunç oversaw the transition of Maxim’s manufacturing to a more flexible hybrid production model and improved overall manufacturing execution. In 2010, Maxim was one of the first analog companies to transition to 300mm wafer technology. In 2015, Tunç reorganized the company, creating a single organization combining all Business Units along with Sales & Marketing, as well as a focused effort on New Ventures. This new structure will allow the company to better align its current business with the needs of customers, while freeing resources to explore new business opportunities outside of our core business. Tunç was born in Ankara, Turkey, and he holds a BSEE degree from Iowa State University and an MSEE degree from the University of California, Santa Barbara. He serves on the board of directors of the Semiconductor Industry Association (SIA).

Mike served as Chief Financial Officer and Corporate Executive Vice President of FIS, Fortune 500’s #1 financial technology company, from 2009 until 2013. As the President and Chief Operating Officer of Metavante Technologies, Inc., Mike led the successful completion of Metavante’s merger with FIS to create the world’s largest financial technology company. Mike was instrumental in building Metavante from a $93 million annual revenue company into the global leader of financial technology with over $6 billion of annual revenue. Previously, he served as Metavante’s CIO, CFO, head of product development, and head of corporate development, and he led the company’s successful carve-out from a bank holding company and IPO in 2007. During his tenure, Mike led a significant number of acquisitions, public offerings for equity sales and debt raising, and led teams to innovate and build technology. Mike is a Director of Endurance International Group Holdings, Inc. and has served on the Board of West Bend Mutual Insurance Company, for which he chairs the Audit Committee. Mike is a Certified Public Accountant and holds a Master Degree in Business Administration from Northwestern University’s Kellogg School of Business and a B.S. in Accounting and Computer Science from the University of Wisconsin.

Robert A. Bruggeworth serves as President and Chief Executive Officer of Qorvo, Inc., a global leader in the design and manufacture of high performance RF components and compound semiconductors. He also serves on Qorvo’s board of directors. Prior to the merger of RF Micro Devices, Inc. (“RFMD”) and TriQuijnt Semiconductor, Inc. to form Qorvo, Inc., Mr. Bruggeworth served as President and Chief Executive Officer of RFMD and served on the RFMD board of directors. Prior to his appointment as President and CEO, Mr. Bruggeworth served RFMD as both President of the company and Vice President of wireless products. Before joining RFMD, Mr. Bruggeworth held a variety of positions at AMP, Inc., a $5.5 billion supplier of electrical and electronic connection devices, including Divisional Vice President and Area Director for AMP's Asia Pacific Central region; Divisional Vice President of Operations, Asia Pacific; and most recently Divisional Vice President of Computer and Consumer Electronics, based in Hong Kong, China. Mr. Bruggeworth attended Wilkes University in Wilkes-Barre, Pennsylvania, where he earned a Bachelor's degree in electrical engineering. Mr. Bruggeworth became an MSA director in 2007.

Victor Peng (born 1960) is a Taiwanese-American technology executive and CEO of Xilinx, an American technology company that supplies programmable logic devices.